Water Block Air-Cooling Module Multi-Layer Heat-Conducting Structure
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Solution Overview
Problem
Traditional water blocks with single-layer fin structures and limited air-cooling capabilities result in inefficient heat dissipation, necessitating a novel approach that integrates air-cooling and multi-layer heat-conducting structures to enhance cooling efficiency.
Innovation Solution
A water block design incorporating an air-cooling module with cooling fans and a multi-layer heat-conducting structure, where heat pipes assist in heat transfer between layers, and air-cooling fan blades are integrated to enhance heat dissipation, utilizing both air and liquid cooling methods effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer fin structure is used for heat dissipation, then the device complexity is low, but the heat dissipation efficiency is limited
Solution Approach 1:
The heat dissipation structure is divided into multiple independent layers (first heat dissipation layer, second heat dissipation layer, third heat dissipation layer) with each layer containing fins that can dissipate heat independently. This segmentation allows each layer to function autonomously while collectively providing enhanced heat dissipation capacity, resolving the contradiction between structural complexity and heat dissipation efficiency.
Solution Approach 2:
The patent transitions from a single-layer (2D) heat dissipation structure to a multi-layer (3D) structure by stacking multiple heat dissipation layers vertically. This dimensional expansion increases the total heat dissipation surface area without significantly increasing the horizontal footprint, thereby improving heat dissipation efficiency while maintaining relatively compact device dimensions.
2Device complexity
If only water cooling is used, then the device complexity is low, but the heat dissipation effect is limited
Solution Approach 1:
The patent merges water cooling and air cooling systems into a hybrid cooling architecture. The water cooling system circulates coolant through channels in the heat-conducting block, while the air cooling system uses fans to force air through the multi-layer fin structures. This combination allows the system to leverage both liquid and gas cooling mechanisms simultaneously, achieving superior heat dissipation effects compared to either system alone.
Solution Approach 2:
The cooling system is designed to perform multiple cooling functions through different mechanisms: water cooling for high-heat-flux regions through direct contact with the heat source, and air cooling for distributed heat dissipation through the fin structures. This multi-functionality allows the system to handle varying thermal loads effectively, resolving the contradiction between system simplicity and heat dissipation performance.
3Area of stationary object
If the water block casing occupies a large area, then the heat dissipation area is increased, but the space efficiency is reduced
Solution Approach 1:
The patent utilizes the vertical dimension by stacking multiple heat dissipation layers on top of each other, thereby increasing the total heat dissipation surface area without proportionally increasing the horizontal footprint. This vertical arrangement allows the heat dissipation area to expand in the Z-direction while maintaining compact dimensions in the X-Y plane, effectively resolving the contradiction between heat dissipation area and space efficiency.
Solution Approach 2:
The multi-layer fin structures are nested vertically within a compact housing, with each heat dissipation layer containing fins that are arranged to maximize surface area within the available vertical space. This nesting approach allows the system to pack extensive heat dissipation surfaces into a small overall volume, achieving high space efficiency while maintaining large heat dissipation area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation efficiency by utilizing air-cooling and multi-layer heat transfer, increasing the heat dissipation area and enhancing cooling capacity, allowing for rapid heat dissipation even in limited spaces.
Implementation Method 1
A first portion of a heat pipe is provided above the multi-layer heat-conducting structure to fill the gap between the multi-layer heat-conducting structure and the pump bottom casing, and is configured to transfer parts of the heat to the pump bottom casing
Implementation Method 2
A second portion of the heat pipe is provided below the multi-layer heat-conducting structure to fill the gap between the multi-layer heat-conducting structure and the heat-conducting bottom casing, and is configured to conduct the heat to the interlayer of the multi-layer heat-conducting structure
Implementation Method 3
The cooling liquid is driven by the water pump to enter the multi-layer heat-conducting structure from the pump bottom casing for heat absorption and heat dissipation, and flows out of the water pump for circulation
Implementation Method 4
air-cooling fan blades are arranged inside the air-cooling shell to constitute the air-cooling module
Data Source
AI summary
A water block includes an air-cooling module, a multi-layer heat-conducting structure and a water pump. The air-cooling module is provided above the water pump, and a pump bottom casing is provided below the water pump. The multi-layer heat-conducting structure is provided below the pump bottom casing, and a heat-conducting bottom casing is provided below the multi-layer heat-conducting structure. The multi-layer heat-conducting structure is formed, from top to bottom, by a top layer, a main body, an interlayer, and a bottom layer. A multi-layer heat-dissipation fin is provided inside the multi-layer heat-conducting structure.