Water-Cooled Package Structure With Anti-Fouling Copper Pins
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Solution Overview
Problem
Conventional water-cooling components for semiconductor devices have insufficient cooling capacity due to the low thermal conductivity of materials used in cooling pins, which is inadequate for modern high-power computing chips.
Innovation Solution
A package structure incorporating a water-cooling component with high thermal conductivity materials, such as copper, and an anti-fouling coating to prevent oxidation and corrosion, ensuring negligible impact on thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional materials (silicon, aluminum, polydimethylsiloxane) are used for cooling pins, then the material is compatible with coolant and easy to manufacture, but the thermal conductivity is low and cooling capacity is insufficient
Solution Approach 1:
The patent changes the material parameter from conventional low thermal conductivity materials (silicon, aluminum, polydimethylsiloxane) to high thermal conductivity materials (copper, aluminum alloy, copper alloy), directly addressing the insufficient cooling capacity for high-power computing chips
Solution Approach 2:
The patent employs composite material structures including copper alloys and aluminum alloys with specific compositional ranges, combining different elements to achieve optimal balance between thermal conductivity, mechanical properties, and manufacturability
2Temperature
If high thermal conductivity materials like copper are used for cooling pins, then cooling capacity is enhanced, but oxidation and corrosion occur in water environment
Solution Approach 1:
The patent introduces a coating layer as an intermediary substance between the high thermal conductivity material (copper or aluminum alloy) and the water coolant, preventing direct contact and thus preventing oxidation and corrosion while maintaining thermal performance
Solution Approach 2:
The patent creates a composite structure combining the high thermal conductivity base material with a protective coating material, forming a multi-layer composite that simultaneously provides thermal management and corrosion protection functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced cooling capacity while protecting the high thermal conductivity materials from oxidation and corrosion, maintaining effective heat dissipation for high-power computing applications.
Implementation Method 1
The water-cooling component includes a material having high thermal conductivity
Implementation Method 2
an anti-fouling coating coated on the material having high thermal conductivity. As such, oxidation/corrosion of the high thermal conductivity material may be prevented using the anti-fouling coating
Data Source
AI summary
A package structure includes a circuit substrate, a semiconductor device, a plurality of cooling pins, a cooler lid, an anti-fouling coating and a top lid. The semiconductor device is disposed on and electrically connected to the circuit substrate. The cooling pins are disposed on the semiconductor device. The cooler lid is attached to the cooling pins, wherein the cooler lid includes an inlet opening and an outlet opening exposing portions of the cooling pins. The anti-fouling coating is coated on the cooling pins and on an inner surface of the cooler lid. The top lid is attached to an outer surface of the cooler lid.