Water-Cooled Solid State Switching for Stable Steam Generation
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Solution Overview
Problem
Conventional steam bath systems suffer from temperature overshoots, noise, and energy inefficiencies due to electrical contactor-based thermostats, and the added costs and reliability issues of using heat sinks and fans for cooling electronic components in steam generating apparatus.
Innovation Solution
A thermostatically controlled steam generating system that uses a solid state switching device in thermal contact with a highly thermally-conductive material, such as brass, to cool the switching device via heat transfer with water flowing through the system, eliminating the need for additional cooling sources like heat sinks and fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If electrical contactors are used for temperature control, then the system can be activated and deactivated, but significant temperature overshoots and noise occur
Solution Approach 1:
The patent replaces mechanical electrical contactors with electronic solid state switching devices (triacs) for temperature control. This substitution eliminates the mechanical switching action that causes noise and temperature overshoots, providing smoother and quieter temperature regulation while maintaining automated control functionality.
Solution Approach 2:
The patent changes the switching parameter from binary (on/off) contactor operation to variable duty cycle control using solid state triacs. This allows the heater to operate at intermediate power levels, preventing temperature overshoots by modulating the heating element's power input based on temperature feedback, thereby achieving stable temperature maintenance.
2Temperature
If heat sinks and fans are added to cool electronic components, then cooling capability is improved, but system complexity and cost increase
Solution Approach 1:
The patent merges the cooling function into the existing steam generation system by routing a portion of the water supply flow through a heat sink assembly that is thermally coupled to the solid state switching devices. This integration eliminates the need for separate fans and external cooling systems, reducing overall system complexity while maintaining effective cooling of electronic components.
Solution Approach 2:
The system uses its own water supply to cool the electronic components through the heat sink. The flowing water absorbs heat from the solid state switching devices without requiring external power sources or additional cooling mechanisms, allowing the system to self-regulate component temperatures using resources already available in the steam generator.
3Temperature
If fans are used for cooling, then heat dissipation is improved, but reliability decreases due to fan failures in dusty environments
Solution Approach 1:
The patent replaces the mechanical fan-based cooling system with a liquid cooling system using water flow through heat sinks. This substitution eliminates moving parts that can fail, providing reliable passive cooling that is immune to dust and dirt accumulation, thereby significantly improving system reliability while maintaining effective heat dissipation.
4Measurement precision
If solid state switching devices are used, then temperature control precision is improved, but heat generation increases requiring additional cooling
Solution Approach 1:
The patent combines the cooling requirement of the solid state switching devices with the existing water supply system by incorporating heat sink assemblies in the water flow path. This integration allows the cooling function to be provided by the water that is already part of the steam generation process, efficiently managing the heat generated by precision temperature control components without adding separate cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces energy inefficiencies and noise while maintaining precise temperature control, minimizing the need for additional cooling components and reducing maintenance, as the water flow provides effective cooling for the electronic components without requiring extra power or space.
Implementation Method 1
a solid state switching device in thermal contact with said highly thermally-conductive material so that the switching device is cooled via heat transfer to the water
Data Source
AI summary
A steam generating system for use in a steam bath includes thermostatically controlled steam generating means for maintaining the steam bath environment at a desired temperature, means defining a water inlet path for conducting water from a water supply to the steam generating means, said inlet-defining means including an area of highly thermally-conductive material in thermal contact with the water. The thermostatically controlled steam generating means includes an electrically powered heating element, and a solid state switching device for controlling the amount of electricity flowing in the heating element. The solid state switching device is in thermal contact with said highly thermally-conductive material so that the switching device is cooled via heat transfer to the water flowing in the inlet path.