Water Heater Electronics Cooling Through Refrigerant Line Coupling

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Solution Overview

Problem

Water heater appliances face challenges in energy efficiency due to ambient environmental conditions, such as extreme temperatures, and the need to effectively operate microprocessors in harsh environments.

Innovation Solution

A water heater appliance design that includes a housing, a tank, a refrigeration system, an electronics board, a conductive interface, and a conduction line, where the conductive interface with a plurality of fins is used to convey waste heat from the electronics board to the refrigeration system, enhancing heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If a heat pump water heater uses a sealed refrigeration system to heat water, then energy efficiency is improved, but the system performance is limited by extreme ambient temperatures in untreated environments

Engineering Contradiction:

Improveenergy efficiencyVSAvoidsystem performance in extreme temperatures

Core Design Contradiction:

Use of energy by moving objectVSReliability

Solution Approach 1:

The invention converts the waste heat generated by the microcontroller and electronics board into a useful resource by directing it to preheat the refrigerant before it enters the heat exchange cycle. This approach transforms harmful heat generation (which normally reduces system efficiency) into a beneficial preheating mechanism that improves overall system performance, particularly in cold ambient conditions where every degree of refrigerant preheating matters for system reliability and efficiency

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Extent of automation

If the microcontroller and electronics board are installed in the water heater appliance, then the appliance can be controlled, but the electronics are exposed to harsh environmental conditions that reduce reliability

Engineering Contradiction:

Improvecontrol capabilityVSAvoidelectronics operation in harsh environment

Core Design Contradiction:

Extent of automationVSReliability

Solution Approach 1:

The invention implements self-service cooling where the electronics board and microcontroller use their own generated waste heat to preheat the refrigerant, creating a beneficial feedback loop. The electronics naturally produce heat during operation, and this heat is redirected through thermal coupling to the refrigerant line, allowing the system to self-regulate without additional cooling components while improving overall efficiency

Inventive Principle:

Principle #25Self-service

3Reliability

If waste heat from the electronics board is dissipated to the ambient environment, then the electronics are cooled, but energy is lost without being utilized

Engineering Contradiction:

Improveelectronics coolingVSAvoidwaste heat loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The invention merges the cooling function for electronics with the heating function of the refrigeration system by thermally coupling the electronics board to the refrigerant line. The waste heat from electronics that would normally be discarded is instead combined with the refrigerant stream, allowing simultaneous electronics cooling and refrigerant preheating in a single integrated thermal management solution

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves the energy efficiency of water heater appliances by effectively transferring waste heat from the electronics board to the refrigeration system, even in extreme ambient conditions, thereby enhancing the overall performance and reliability of the appliance.

Implementation Method 1

The conduction line may extend between the conductive interface and the sealed refrigerant loop to convey waste heat from the electronics board to the sealed refrigerant loop

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The refrigeration system may include a sealed refrigerant loop in thermal communication with the tank to heat the interior volume

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 3

The sealed system generally includes a condenser configured in a heat exchange relationship with a water storage tank within the water heater appliance and an evaporator

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 4

The sealed system generally includes a condenser configured in a heat exchange relationship with a water storage tank within the water heater appliance

Methodology Applied

Scientific EffectCondensation: Condensation

Data Source

PatentUS20250109887A1Water heater appliance and heat transfer assembly

Publication Date: 2025.04.03 HAIER US APPLIANCE SOLUTIONS INC

AI summary

A water heater appliance or heat transfer assembly may include a refrigeration system, an electronics board, a conductive interface, and a conduction line. The refrigeration system may include a sealed refrigerant loop attached to a housing. The electronics board may be attached to the housing apart from the refrigeration system. The conductive interface may be proximal to the electronics board and spaced apart from the sealed refrigerant loop. The conductive interface may include a plurality of fins extending away from the electronics board. The conduction line may extend from a first end proximal to the conductive interface to a second end proximal to the sealed refrigerant loop and above the first end to convey waste heat from the electronics board to the sealed refrigerant loop. The conductive interface may define an internal channel within which a portion of the conduction line is disposed.