Water Path Heat-Conductive Layer for Power Converter Cooling
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Solution Overview
Problem
The existing cooling structures for power conversion devices, as described in PTL 1, are unable to enhance the cooling performance effectively.
Innovation Solution
A heating element cooling structure is implemented, featuring a water path member through which a refrigerant flows, and a heat conductive layer with a higher thermal conductivity than the water path member, which is continuously formed in two regions: one close to and one away from the heating element, covering the outer surface of the water path member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional cooling structure with a water path member is used, then the device has a simple structure, but the cooling performance is insufficient
Solution Approach 1:
The patent applies composite materials by combining the water path member (made of material A) with the heat conductive layer (made of material B having higher thermal conductivity). This composite structure allows the system to achieve superior cooling performance by leveraging the complementary properties of both materials, while the layer integration keeps the overall structural complexity manageable.
Solution Approach 2:
The heat conductive layer is selectively applied to specific regions of the water path member's outer surface, particularly in areas requiring enhanced heat dissipation. This local quality approach optimizes cooling performance where most needed without unnecessarily complicating the entire structure, balancing performance improvement with structural simplicity.
2Temperature
If the heat conductive layer is formed only in one region, then the manufacturing process is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The heat conductive layer is divided into multiple discrete regions along the water path member, with each region strategically positioned to address specific heat dissipation needs. This segmentation allows optimized thermal management across different zones while maintaining manufacturing feasibility through standardized layer application processes.
Solution Approach 2:
Different regions of the water path member receive heat conductive layers with optimized properties tailored to local thermal requirements. Regions closer to heat-generating components receive enhanced heat conduction treatment, while other areas receive appropriate thermal management, achieving superior overall heat dissipation efficiency without uniform complexity throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves the cooling performance of the power conversion device by allowing heat dissipation through both regions, reducing thermal resistance, and enhancing the product's lifespan by minimizing stress on the heat conduction member.
Implementation Method 1
a heat conductive layer covering an outer surface of the water path member, wherein the heat conductive layer is formed of a material having a thermal conductivity higher than a thermal conductivity of the water path member
Data Source
AI summary
A heating element cooling structure includes a heating element, a water path member through which a refrigerant flows, and a heat conductive layer covering an outer surface of the water path member, wherein the heat conductive layer is formed of a material having a thermal conductivity higher than a thermal conductivity of the water path member, wherein the heat conductive layer includes a first region formed on the outer surface, of the water path member, close to the heating element, and a second region formed on the outer surface, of the water path member, away from the heating element, and wherein the first region and the second region of the heat conductive layer are continuously formed.