Phase-Change Cooling Panel Using Water in a SUS Heat Spreader
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material cost, and the need for expensive alternatives like copper and gold, while refrigerant-based systems face issues with chemical reactions and environmental regulations, leading to inefficient heat dissipation and increased product size.
Innovation Solution
The use of stainless steel (SUS) as a thermal conduction panel body filled with water as a refrigerant, which changes phases to enhance heat transfer, combined with a design that minimizes physical spacing from heat sources and allows for efficient phase change circulation, addressing the limitations of aluminum alloys and chemical reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy is used for heat dissipation fins, then thermal conductivity is improved, but material cost increases and chemical reactions with refrigerant occur
Solution Approach 1:
The patent introduces a coating layer as an intermediary between the aluminum alloy heat dissipation fins and the refrigerant. This coating prevents direct chemical contact while allowing thermal energy transfer, thereby eliminating harmful chemical reactions while preserving the high thermal conductivity of aluminum alloy.
Solution Approach 2:
The patent creates a chemically inert environment by using refrigerants that do not react with aluminum alloy materials. This inert environment prevents oxidation and other harmful chemical reactions while maintaining effective heat dissipation through phase change mechanisms.
2Temperature
If copper or gold is used instead of aluminum alloy, then thermal conductivity is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent changes the operating parameters of the heat dissipation system by utilizing phase change mechanisms and optimizing refrigerant flow dynamics. This allows aluminum alloy to achieve thermal performance comparable to copper or gold through enhanced heat transfer processes, eliminating the need for expensive materials.
Solution Approach 2:
The patent employs phase transition of the refrigerant (liquid to gas and back) as the primary heat transfer mechanism. This phase change process provides highly efficient heat absorption and release, compensating for the lower thermal conductivity of aluminum alloy compared to copper or gold, thereby achieving superior heat dissipation with cost-effective materials.
3Temperature
If physical spacing from heat sources is increased, then heat dissipation area is improved, but product thickness increases
Solution Approach 1:
The patent transitions from one-dimensional heat dissipation (increasing distance from heat source) to three-dimensional heat dissipation by implementing phase change circulation throughout the refrigerant flow paths. This allows heat to be dissipated efficiently within a compact thickness by utilizing the entire volume of the heat dissipation fins through active refrigerant circulation.
Solution Approach 2:
The patent ensures continuous heat dissipation by maintaining active refrigerant circulation through the heat dissipation fins. The continuous phase change process (evaporation and condensation) ensures that heat is constantly absorbed and released throughout the refrigerant flow paths, maximizing heat dissipation area within the available thickness without requiring increased physical spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation performance, reduces manufacturing costs, and complies with environmental regulations by using water as a refrigerant, achieving superior heat transport and reducing product thickness without increasing size.
Implementation Method 1
a thermal conduction panel body having therein a refrigerant flow space having a predetermined thickness; and a refrigerant with which the refrigerant flow space of the thermal conduction panel body is filled, in which the thermal conduction panel body is made of a metallic material capable of transferring heat into the refrigerant flow space from the outside
Implementation Method 2
the refrigerant is water that is changed in phase from a liquid state to a gaseous state or from a gaseous state to a liquid state
Implementation Method 3
the thermal conduction panel body is made of a metallic material capable of transferring heat into the refrigerant flow space from the outside
Data Source
Figure 1
Figure 2(1)~2(5)
Figure 3
AI summary
The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, and an active heat dissipation apparatus according to the present disclosure includes a thermal conduction panel body having therein a refrigerant flow space having a predetermined thickness, and a refrigerant with which the refrigerant flow space of the thermal conduction panel body is filled, in which the thermal conduction panel body is made of a metallic material capable of transferring heat into the refrigerant flow space from the outside, and in which the refrigerant is water that is changed in phase from a liquid state to a gaseous state or from a gaseous state to a liquid state by thermal conductivity of the thermal conduction panel body, thereby significantly improving heat dissipation performance.