Active Cooling Panel Structure for Water Phase-Change Heat Dissipation
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Solution Overview
Problem
Current active heat dissipation systems for electronic devices face limitations in improving heat dissipation performance due to the restricted thermal conductivity of materials used in heat dissipation fins and the challenges of using water as a refrigerant, which can cause chemical reactions and increase internal pressure, leading to product restrictions and environmental concerns.
Innovation Solution
An active heat dissipation apparatus utilizing a thermal conduction panel body with a refrigerant flow space that includes a vaporization zone and a condensation zone, where the panel is made of stainless steel and designed to minimize thermal concentration by bending and joining metal panel members to create a symmetric refrigerant flow path, allowing for efficient gas-liquid circulation and phase change of water as a refrigerant, thereby enhancing heat transfer and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water is used as a refrigerant to improve heat dissipation performance, then heat transfer efficiency is enhanced, but chemical reactions occur and internal pressure increases
Solution Approach 1:
A hydrophobic coating layer is applied to the inner surface of the heat dissipation chamber to act as an intermediary between water and the chamber walls. This coating prevents chemical reactions while allowing efficient heat transfer, and the chamber is designed with pressure relief features to manage internal pressure buildup during phase change cycles.
Solution Approach 2:
The system dynamically adjusts operating parameters including refrigerant quantity, heating power, and chamber pressure to optimize water's phase change behavior. By controlling these parameters, the system maximizes heat dissipation during evaporation while preventing excessive pressure buildup and chemical degradation.
2Temperature
If thermal conduction materials are used in heat dissipation fins to improve heat transfer, then thermal conductivity increases, but material selection is restricted and manufacturing complexity increases
Solution Approach 1:
The patent changes the fundamental heat transfer mechanism from thermal conduction through solid materials to phase change heat transfer using water. This parameter change allows the use of common, inexpensive materials for the heat dissipation chamber while achieving superior heat transfer through water's latent heat of vaporization, eliminating material selection restrictions.
Solution Approach 2:
The system utilizes water's phase transition from liquid to vapor in the heat dissipation chamber to achieve high heat transfer efficiency. This phase change mechanism replaces the need for high thermal conductivity materials, as the latent heat absorption during evaporation provides much higher heat transfer coefficients than solid conduction materials can achieve.
3Productivity
If the number of heat generation elements is increased to improve data transmission capacity, then channel capacity increases, but heat dissipation difficulty increases
Solution Approach 1:
The system employs water's phase change from liquid to vapor to dissipate heat from multiple heat generation elements. The latent heat absorption during evaporation provides extremely high heat transfer capacity that can handle the thermal load from increased numbers of transmitters and filters, enabling the system to support higher data transmission capacities without thermal deterioration.
Solution Approach 2:
The patent implements a distributed heat dissipation approach where multiple heat generation elements are coupled to the heat dissipation chamber, allowing each element to benefit from the phase change heat transfer mechanism. This copying of the heat transfer interface across multiple elements enables scalable heat dissipation as system complexity increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves heat dissipation performance by maximizing heat transport ability, reducing thermal concentration, and ensuring compliance with environmental regulations by using water as a refrigerant, while also simplifying the manufacturing process and reducing costs.
Implementation Method 1
a first refrigerant flow path 210 that is a vaporization zone in which the thermal conduction panel body 200 is supplied with heat from a heat generation element 140 to be heat dissipated
Implementation Method 2
thermal conduction panel body 200 having a refrigerant flow space 205 configured to provide a space in which gas-liquid circulation is performed so that a refrigerant dissipates heat while changing phases
Implementation Method 3
a second refrigerant flow path 220 configured to serve as a route through which a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, flows
Implementation Method 4
configured to serve as a route through which a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, flows toward the first refrigerant flow path by surface tension or gravity
Implementation Method 5
configured to serve as a route through which a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, flows toward the first refrigerant flow path by surface tension or gravity
Data Source
AI summary
The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, and the active heat dissipation apparatus includes a thermal conduction panel body having a refrigerant flow space configured to provide a space in which gas-liquid circulation is performed so that a refrigerant dissipates heat while changing phases in a closed space having an interior filled with the refrigerant, in which the refrigerant flow space includes a first refrigerant flow path that is a vaporization zone in which the thermal conduction panel body is supplied with heat from a heat generation element that is a heat dissipation target, and a second refrigerant flow path configured to serve as a route through which a liquid refrigerant in the refrigerant, which is condensed into a liquid state from a gaseous state, flows toward the first refrigerant flow path by surface tension or gravity.