Water-Resistant Capture Device for Wired Electro-Magnetic Components
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Solution Overview
Problem
Existing light string technologies face challenges in providing a water-resistant enclosure for wired electro-magnetic components, particularly LEDs, which requires complex molding operations and lacks field replaceability and cost-effective manufacturing processes.
Innovation Solution
A water-resistant capture device comprising a base module and a connecting cap module that encloses electro-magnetic components, allowing for deformation to provide compressive seals and accommodate various component sizes, with a sealing agent for enhanced water resistance and solderless connections, enabling rapid assembly and cost reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex molding operations are used to provide water-resistant enclosure, then water resistance is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The capture device is divided into separate base module and cap module components that can be manufactured independently through simpler processes, then assembled together to form the water-resistant enclosure, eliminating the need for complex single-piece molding operations
Solution Approach 2:
A sealing agent is introduced as an intermediary substance between the base module and cap module to create the water-resistant seal, replacing the need for complex molded sealing structures and enabling the use of simpler manufacturing processes
2Reliability
If complex molding operations are used to provide water-resistant enclosure, then water resistance is improved, but manufacturing cost increases
Solution Approach 1:
The capture device is divided into separate base module and cap module components that can be manufactured independently through simpler processes, then assembled together to form the water-resistant enclosure, eliminating the need for complex single-piece molding operations
Solution Approach 2:
The design allows for the use of lower-cost materials and manufacturing processes for individual components, with the sealing agent providing sufficient water protection without requiring expensive durable molded seals, reducing overall manufacturing cost
3Ease of operation
If traditional light string components are used, then assembly is simple, but field replaceability is lost
Solution Approach 1:
The capture device is divided into separate base module and cap module that can be independently removed and replaced, enabling field replacement of individual components while maintaining simple assembly through the modular design
Solution Approach 2:
The base module is designed to be deformable, allowing it to adapt during assembly and disassembly operations, facilitating both simple initial assembly and easy later replacement without requiring complex tools or procedures
4Stability of the object's composition
If non-deformable enclosure is used, then structural stability is improved, but adaptability to various component sizes is reduced
Solution Approach 1:
The base module is designed to be deformable, allowing it to flex and adapt its shape during assembly to accommodate different electro-magnetic component sizes, while maintaining structural stability once assembled and sealed
Solution Approach 2:
The deformable base module provides localized flexibility at the sealing interface while maintaining overall structural integrity, allowing adaptation to various component sizes without compromising the stability of the complete assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective, field-replaceable, and water-resistant light string assembly method that reduces manufacturing complexity and costs, while ensuring reliable water resistance and easy assembly, facilitating the use of low-cost parts and off-site component manufacturing.
Implementation Method 1
the base module may be deformable and deform when affixed to the cap module
Implementation Method 2
The sealing agent may provide a water resistant seal between a base and a housing element
Data Source
AI summary
Apparatus and associated methods relate to a water-resistant capture device for enclosing wired electro-magnetic components, the capture device having a base module and a connecting cap module, wherein when the base module and cap module enclose an electro-magnetic component and the base module is connected to the cap module, one or more electric wires are passed through wire apertures formed by a combined base module and cap module. In some embodiments, the base module may be deformable and deform when affixed to the cap module. In some embodiments a sealing agent may be disposed in an interior of the capture device. The sealing agent may, for example, be assembled in solid form and be at least partially liquified for distribution. In an exemplary embodiment, an LED may be captured within the capture device. The sealing agent may provide a water resistant seal between a base and a housing element.