Water-Soluble Package with Anionic Surfactant for Cold Water Dissolution

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Solution Overview

Problem

Water-soluble packages used for dishwashing or laundry treatments often face issues with incomplete dissolution, especially in cold water, and are sensitive to moisture and humidity, compromising their mechanical properties and processability.

Innovation Solution

A water-soluble package with a substrate thickness of 30 microns to 200 microns, containing at least 8wt% anionic surfactant and a film-forming material, such as partially hydrolysed polyvinyl alcohol, which provides improved flexibility, heat sealability, and resistance to water drops, ensuring complete dissolution in cold water without sticking or leakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the water-soluble substrate is made thin to improve cold-water solubility, then dissolution speed is improved, but mechanical properties and processability deteriorate

Engineering Contradiction:
Improvedissolution speedVSAvoidmechanical properties
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The patent applies parameter changes by incorporating surfactants at specific concentrations (0.1-10 wt%, preferably 0.5-5 wt%) into the water-soluble substrate formulation. This chemical parameter modification enables the substrate to maintain adequate thickness (preserving mechanical strength and processability) while achieving improved cold-water solubility through the surfactant-enhanced dissolution mechanism.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If the water-soluble substrate is made thin to improve cold-water solubility, then dissolution speed is improved, but heat sealability deteriorates

Engineering Contradiction:
Improvedissolution speedVSAvoidheat sealability
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The patent modifies the chemical composition parameters by adding surfactants at optimized levels (0.1-10 wt%). This formulation change allows the substrate to maintain sufficient thickness for proper heat sealing while achieving rapid cold-water dissolution, thus resolving the contradiction between manufacturability and dissolution performance.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the water-soluble substrate includes salt to reduce moisture sensitivity, then resistance to stickiness is improved, but complete dissolution in cold water deteriorates

Engineering Contradiction:
Improveresistance to stickinessVSAvoidcomplete dissolution
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent introduces surfactants as intermediary substances that mediate between the substrate and water. The surfactant molecules reduce surface tension and enhance wetting, enabling complete cold-water dissolution without requiring salt additives. This intermediary mechanism provides both moisture resistance and complete solubility simultaneously.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Strength

If the water-soluble substrate is made thick to improve mechanical properties, then flexibility is improved, but dissolution speed deteriorates

Engineering Contradiction:
ImproveflexibilityVSAvoiddissolution speed
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The patent changes the chemical parameters of the substrate by incorporating surfactants at concentrations of 0.1-10 wt%. This formulation modification enables thicker substrates to dissolve rapidly in cold water, as the surfactants penetrate and accelerate the dissolution process throughout the substrate matrix, thus maintaining both mechanical integrity and fast dissolution.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables complete dissolution in cold water, enhances mechanical properties like flexibility and heat sealability, and reduces sensitivity to moisture, ensuring effective and convenient use in washing applications.

Implementation Method 1

said substrate comprising a film-forming material; and at least 8wt% surfactant, wherein the surfactant is an anionic surfactant

Methodology Applied
Scientific EffectSurfactant: Surfactant

Implementation Method 2

a water-soluble package having a water-soluble substrate with a thickness from 30 microns to 200 microns... which substrate includes a film-forming material

Methodology Applied
Scientific EffectHydrolysis: Hydrolysis

Data Source

PatentEP3649058B1Water-soluble package
Publication Date: 2020.12.23 UNILEVER GLOBAL IP LTD

AI summary

A water-soluble package for holding a unit dose composition, the water-soluble package comprising a water-soluble substrate having a thickness from 30 micrometres to 200 micrometres, said substrate comprising: i. a film-forming material; and, ii. at least 8wt% surfactant. wherein the surfactant is an anionic surfactant. Use of the water-soluble package for washing dishes, treating textiles or laundering textiles.