Water-Soluble Resin Coating for Semiconductor Plating

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Solution Overview

Problem

Existing methods for preventing the movement of ionized atoms in semiconductor devices and circuit board packages, such as forming a barrier layer, often result in damage to the wiring and insulating film or complicate the production process, and fail to adequately address abnormal growth due to conductive impurities.

Innovation Solution

A surface coating method using a material containing a water-soluble resin, organic solvent, water, and optional crosslinking agent, antioxidant, and surfactant is applied to cover the insulating film, preventing abnormal growth during electroless plating by forming a coating that interacts with the insulating film and covering conductive impurities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If electroless plating is performed directly on the insulating film, then the plating process can be simplified, but conductive impurities on the insulating film cause abnormal growth and short circuits

Engineering Contradiction:

Improveplating process simplicityVSAvoidshort circuit prevention

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

A coating layer is formed on the insulating film surface before electroless plating to prevent abnormal growth. The coating layer is applied in advance to cover conductive impurities, ensuring that when plating occurs, the impurities are already protected and cannot initiate abnormal copper growth.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

A coating layer made of water-soluble resin serves as an intermediary between the insulating film and the electroless plating solution. This intermediate layer prevents direct interaction between the plating solution and conductive impurities on the insulating film surface, eliminating the harmful effect while allowing the plating process to proceed normally on the wiring.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If strong acid or base washing is performed to remove conductive impurities, then abnormal growth can be prevented, but the wiring and insulating film are damaged

Engineering Contradiction:

Improveabnormal growth preventionVSAvoidwiring and insulating film integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

A disposable coating layer is applied on the insulating film surface that serves as a temporary protective barrier during plating. This coating layer is inexpensive and can be easily removed after plating, replacing the need for damaging strong acid or base washing processes.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The water-soluble resin coating acts as a gentle intermediary that protects the insulating film from direct exposure to harsh chemicals. Instead of using strong acid or base to remove impurities, the coating layer provides protection through a mild, selective mechanism that preserves the underlying structures.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If a barrier layer is formed on the insulating film before wiring, then atom movement is prevented, but the production process becomes complicated

Engineering Contradiction:

Improveatom movement preventionVSAvoidproduction process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The water-soluble resin coating layer serves multiple functions: it prevents abnormal growth during plating, protects the insulating film from damage, and can be easily removed after plating. This single layer replaces multiple separate processes including impurity removal, film protection, and plating control, simplifying the overall production process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The coating material uses water-soluble resin with specific molecular weight and hydroxyl group content parameters optimized for the intended functions. By controlling these parameters, the coating provides effective protection during plating while maintaining ease of removal, achieving multiple goals through parameter optimization rather than process complexity.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively prevents abnormal growth on the insulating film during plating, reducing the risk of short circuits and maintaining the integrity of both the wiring and insulating film, thereby enhancing the reliability and production efficiency of semiconductor devices and circuit board packages.

Implementation Method 1

applying a surface coating material to a layered structure so as to cover at least a surface of an insulating film of the layered structure, to form a coating on the surface of the insulating film

Methodology Applied

Scientific EffectEvaporation: Evaporation

Data Source

PatentUS8759161B2Surface coating method, semiconductor device, and circuit board package

Publication Date: 2014.06.24 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

To provide a surface coating method, which contains applying a surface coating material to a layered structure so as to cover at least a surface of an insulating film of the layered structure, to form a coating on the surface of the insulating film, wherein the surface coating material contains a water-soluble resin, an organic solvent, and water, and wherein the layered structure contains the insulating film exposed to an outer surface, and a patterned metal wiring exposed to an outer surface.