Waterproof Base Material Using Waste Circuit Board Powder
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Solution Overview
Problem
Existing wooden plates are prone to swelling and deformation due to water absorption and drying, leading to issues like shrinkage, warping, and cracking. Additionally, the disposal of waste circuit boards poses environmental hazards due to the presence of non-degradable materials and heavy metals.
Innovation Solution
A base material for waterproof walls and floors is developed using a base plate made from treated waste circuit board powder and glass fiber cloth, bonded with a solvent-free double-component polyurethane adhesive. The base plate is prepared by extracting glass fiber cloth, crushing and drying the circuit board, and hot-pressing the mixture with a fiber net and sizing agent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wooden plates are used for walls and floors, then they provide comfort and aesthetic appearance, but they are prone to swelling, deformation, warping, and cracking due to water absorption and drying
Solution Approach 1:
The patent uses waste circuit board powder mixed with resin as a composite material to create a base plate that combines the dimensional stability of inorganic materials with the workability of organic binders, achieving resistance to water absorption and deformation while maintaining structural integrity
Solution Approach 2:
The patent modifies the chemical composition and physical structure of the base plate by controlling resin content (10-20%), particle size distribution, and curing parameters to achieve optimal water resistance and dimensional stability, transforming the material properties to resist environmental degradation
2Productivity
If waste circuit boards are disposed of through stacking or landfilling, then they occupy space and cause resource loss, but they also pose environmental hazards due to non-degradable materials and heavy metals
Solution Approach 1:
The patent transforms waste circuit boards, which are typically considered harmful electronic waste containing heavy metals and non-degradable materials, into a valuable construction material. The waste circuit board powder serves as a filler and structural component in the base plate, converting environmental hazards into resource benefits while reducing pollution
Solution Approach 2:
The patent recovers useful components from waste circuit boards by extracting and processing the powder form, separating valuable materials from harmful components. The recovered powder is then utilized as a functional material in construction applications, achieving both waste reduction and resource recovery
3Ease of manufacture
If conventional adhesives are used to bond base plates, then assembly is simplified, but environmental pollution and health risks increase due to solvent emissions
Solution Approach 1:
The patent employs a solvent-free adhesive system that cures through chemical reaction rather than evaporation, eliminating the need for volatile organic compounds. This approach replaces traditional solvent-based adhesives with a environmentally friendly alternative that maintains bonding effectiveness without harmful emissions
Solution Approach 2:
The patent uses a water-based or solvent-free adhesive formulation that creates an inert bonding environment, eliminating flammable and toxic solvents while maintaining effective adhesion properties. This approach ensures safe handling and application without compromising assembly ease
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting base material exhibits improved water resistance, reduced natural deformation, enhanced nail resistance, and increased use strength compared to traditional wooden plates. The adhesive used is environmentally friendly, and the base plate has a water absorption rate of less than 0.2%, demonstrating good industrial practicability.
Implementation Method 1
after mixing modified cardanol, polyether polyol, hydroxyl-terminated branched polysiloxane and a molecular sieve, dehydrating the mixture at a temperature of 110-120° C. under a vacuum condition until a moisture content is less than 1000 ppm
Implementation Method 2
drying the remaining circuit board powder under a temperature of 100° C., wherein a moisture content is less than 3% by vacuum drying
Implementation Method 3
paving the mixture layer by layer with the fiber net, prepressing the mixture, and then hot-pressing the mixture to form the base plate
Implementation Method 4
mixing the component A and the component B to obtain an adhesive
Data Source
AI summary
The present invention relates to the field of plates, and discloses a base material for a waterproof wall and floor and a preparation method therefor, belonging to the technical field of plates. The base material comprises a base plate and melamine decorative paper, and the base plate and the melamine decorative paper are bonded by an adhesive; and the preparation method comprises the following steps: step 1: preparing a base plate, and step 2: coating 10 an adhesive on a surface of the base plate, then attaching the melamine decorative paper, and placing for 3 days at a temperature of 20° C. to obtain the base material for the waterproof wall and floor.