Reflow-Solderable Waterproof Connector for Camera Modules

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Solution Overview

Problem

Existing connector configurations for on-vehicle modules, such as those using the FAKRA and USCAR standards, face challenges with waterproofness when using reflow soldering, as the heat can damage seal members like O-rings, leading to loss of waterproof functionality and increased connector size due to the need for screw holes and contact stroke accommodation.

Innovation Solution

A connector design featuring a cylindrical external conductor with heat-resistant first and second seal members, made from materials like silicone rubber, which can withstand reflow soldering temperatures up to 260°C, allowing for surface mounting on a substrate while maintaining waterproofness without the need for a relay connector, thus eliminating the requirement for screw holes and reducing overall size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a conventional connector with O-ring seal members is used and mounted by reflow soldering, then the connector can be surface-mounted on the substrate, but the seal members are damaged by the heat and lose waterproofness

Engineering Contradiction:
Improvesurface mounting capabilityVSAvoidwaterproofness
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The seal members are changed from conventional materials to heat-resistant materials (silicone rubber or fluororubber) that can withstand reflow soldering temperatures of 260°C or higher, enabling surface mounting while maintaining waterproofness

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The connector uses composite construction with heat-resistant seal members (silicone rubber or fluororubber) combined with metal conductors and insulators, creating a structure that survives reflow soldering while maintaining sealing function

Inventive Principle:
Principle #40Composite materials

2Strength

If screw holes are provided in the rear case for fastening the relay connector, then the connector can be securely mounted, but the overall size increases and internal space is reduced

Engineering Contradiction:
Improvemounting securityVSAvoidinternal space
Core Design Contradiction:
StrengthVSVolume of moving object

Solution Approach 1:

The relay connector is completely removed from the structure, eliminating the need for screw holes and associated mounting hardware, thereby reducing overall size and increasing internal space while maintaining secure connection through direct substrate mounting

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The connector base directly mounts to the substrate without requiring a separate relay connector, combining multiple functions into a single integrated structure that reduces component count and space requirements

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If the position of the substrate is pushed downward to ensure contact stroke, then the connector can function properly, but the overall size increases

Engineering Contradiction:
Improvecontact strokeVSAvoidoverall size
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The connector uses elastic deformable seal members that can dynamically adjust to ensure proper contact stroke without requiring fixed downward positioning, allowing the substrate to remain in its original position while maintaining reliable electrical contact

Inventive Principle:
Principle #15Dynamics

4Ease of manufacture

If a through hole is formed in the substrate to solder the substrate connector, then the connector can be mounted, but the thickness dimension and weight of the substrate increase

Engineering Contradiction:
Improvemounting capabilityVSAvoidsubstrate thickness
Core Design Contradiction:
Ease of manufactureVSLength of moving object

Solution Approach 1:

The through-hole structure is completely eliminated, replacing it with surface mounting of the connector on the substrate, thereby reducing substrate thickness and weight while maintaining secure electrical connection through surface soldering

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat-resistant seal members enable reliable waterproofing during reflow soldering, reducing the connector's size and expanding internal space within the camera module by eliminating the need for relay connectors and screw holes, while ensuring the connector's functionality is preserved.

Implementation Method 1

the first seal member and the second seal member have heat resistance durable against a temperature of reflow soldering performed when the connector is mounted on the substrate

Methodology Applied
Scientific EffectHeat resistance: Thermal Insulation

Data Source

PatentUS20240204431A1Connector, connector assembly, camera module, and assembly method
Publication Date: 2024.06.20 YAMAICHI ELECTRONICS CO LTD
  • US20240204431A1 patent drawing
  • US20240204431A1 patent drawing
  • US20240204431A1 patent drawing

AI summary

A connector is provided that can be mounted on a surface of a substrate by reflow soldering while ensuring waterproofness due to a seal member. A cylindrical external terminal extends in an axis direction with an outer bush in close contact with an outer circumferential face of the external terminal. An inner bush is in close contact with an inner circumferential face of the external terminal. A contact pin is inserted in the inner bush along the axis direction inside the external terminal, and the outer bush and the inner bush have heat resistance durable against a temperature of reflow soldering performed when the connector is mounted on the substrate. A connector assembly, a camera module and an assembly method are also provided.