Waterproof Structure for Thinned Display Devices
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Solution Overview
Problem
Current thinned display devices face limitations in size due to protruding waterproof glue from the waterproof membrane, which restricts the stacking of structures and hinders the manufacturing of thin display devices.
Innovation Solution
A display device design featuring a solid first waterproof material between the integrated circuit and the display module, along with a colloid second waterproof material, allows for a level top surface and side walls, eliminating the need to remove waterproof glue from the integrated circuit side and enabling unobstructed stacking without size limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fluidal waterproof glue is used for waterproofing, then waterproofing function is achieved, but the glue protrudes from the waterproof membrane due to capillary phenomena, limiting the size of stacked structures
Solution Approach 1:
The waterproofing function is segmented into two distinct materials: a solid waterproof material for sealing and a fluidal waterproof glue for filling. This segmentation allows each material to perform its specialized function without the negative effects of the other, resolving the contradiction between achieving waterproofing and preventing protrusion that limits structure size.
Solution Approach 2:
Different regions of the waterproofing system use different materials with different properties. The solid waterproof material is used where sealing is critical, while the fluidal waterproof glue is used where filling and adaptability are needed. This local differentiation allows the system to achieve both reliable waterproofing and clean surfaces that don't limit structure size.
2Length of stationary object
If the cover structure is raised to prevent size limitation from protruding waterproof glue, then the size limitation is avoided, but it contradicts the manufacturing of thinned display devices
Solution Approach 1:
The harmful protrusion effect is extracted and eliminated by replacing the fluidal waterproof glue with a solid waterproof material in the critical sealing regions. This extraction removes the source of the problem (protruding glue) without requiring compensatory design changes like raising the cover structure, thus maintaining both adequate structure size and device thinness.
3Reliability
If solid waterproof material is disposed between the integrated circuit and the display module, then waterproofing is achieved without protrusion, but the manufacturing process becomes more complex
Solution Approach 1:
The solid waterproof material is disposed in advance between the integrated circuit and the display module during the assembly process. This preliminary placement ensures proper positioning and prevents protrusion issues before subsequent manufacturing steps, actually simplifying the overall process by preventing rework and ensuring consistent results.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates the manufacturing of thinned display devices by preventing waterproof structure protrusion, allowing for complete coverage and planar designs without size constraints, enhancing the attachment of cover structures and touch modules.
Implementation Method 1
fluidal waterproof glue may protrudes from the waterproof membrane of the display device due to capillary phenomena
Data Source
AI summary
A display device includes a display panel and a waterproof structure. The display panel includes a driving substrate and a display module. The driving substrate has an integrated circuit. The display module is disposed on the driving substrate, and the integrated circuit is located at a first side of the display module. The waterproof structure surrounds the display module, and the waterproof structure includes a first waterproof material and a second waterproof material. The first waterproof material is at least disposed at the first side of the display module, and the first waterproof material is disposed between the integrated circuit and the display module.