Waterproof Case Flow Guide Assembly for Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Electronic devices with waterproof functions face challenges in heat dissipation due to the inability to have direct heat dissipation holes, leading to increased internal temperatures and reduced service life.

Innovation Solution

An electronic device design featuring a waterproof case with a flow guide assembly and a cover that includes first and second vent holes, allowing air to enter and flow through the device to facilitate heat dissipation, while maintaining waterproof integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the electronic device is made waterproof with a closed case structure, then waterproof performance is improved, but heat dissipation capability deteriorates

Engineering Contradiction:

Improvewaterproof performanceVSAvoidinternal temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The closed case is segmented into multiple sealed compartments (first sealed space and second sealed space) separated by a partition. This segmentation allows independent heat dissipation control for different electronic modules while maintaining overall waterproof integrity, resolving the contradiction between sealed structure and heat dissipation requirements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat dissipation holes are introduced as intermediary components that allow thermal exchange with the external environment while the case remains waterproof. These holes serve as mediators between the sealed internal space and the external atmosphere, enabling heat dissipation without compromising waterproof performance.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If heat dissipation holes are directly provided on the case, then heat dissipation capability is improved, but waterproof performance deteriorates

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidwaterproof performance

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The case structure exhibits local quality differentiation: most of the case maintains a sealed waterproof structure, while specific localized areas contain heat dissipation holes. This localized modification allows heat dissipation functionality to be introduced without compromising the overall waterproof integrity of the case.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Waterproof films are used to selectively seal or open specific regions of the case. These flexible waterproof membranes allow the case to maintain waterproof performance while accommodating heat dissipation requirements in specific areas, resolving the contradiction between sealed structure and heat dissipation openings.

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If a sealed case structure is used for waterproofing, then waterproof performance is improved, but service life deteriorates due to heat accumulation

Engineering Contradiction:

Improvewaterproof performanceVSAvoidservice life

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The heat dissipation holes enable continuous heat dissipation action throughout device operation. By maintaining constant thermal exchange with the external environment, the system prevents heat accumulation that would otherwise shorten service life, while the waterproof case structure remains intact throughout the extended operational period.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively dissipates heat without compromising waterproofness, prolonging the service life of electronic devices and ensuring continuous operation.

Implementation Method 1

the flow guide assembly comprises a fan and a flow guide plate; the airflow guide plate is provided between the fan and the cover, and the airflow guide plate extends from the top plate of the cover to the fan to block the airflow between the cover and the fan

Methodology Applied

Scientific EffectForced Convection: Forced Convection

Implementation Method 2

the airflow guide plate extends from the top plate of the cover to the fan to block the airflow between the cover and the fan

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10813244B2Electronic device including a waterproof case and flow guide assembly including a fan and an airflow guide plate

Publication Date: 2020.10.20 SIEMENS (CHINA) CO LTD

AI summary

An electronic device includes a waterproof case, including a closed space, and a flow guide assembly, an electronic module and a cover, provided in the closed space. The cover includes a cover top plate and a cover side plate which, together with a case bottom plate and a case side plate, form an accommodation space for accommodating the flow guide assembly and the electronic module. Further, the cover includes a first vent hole and a second vent hole. The flow guide assembly is configured to guide air, entering the accommodation space from the first vent hole, to flow through the electronic module and to be discharged from the second vent hole. The flow guide assembly is further configured to guide air, entering the cavity from the first vent hole, to flow through the electronic module and to be discharged from the second vent hole.