Waterproof Heat-Dissipating Module With Segmented Airflow
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Solution Overview
Problem
Conventional heat-dissipating mechanisms in compact electronic devices, such as power adapters, are inadequate for efficient heat dissipation and often lead to damage from moisture ingress, reducing device lifespan and efficiency.
Innovation Solution
A waterproof heat-dissipating module with a housing structure featuring ventilation and drainage holes, a compartment structure with an inhaling chamber, fan room, and exhausting chamber, and a waterproof slab to separate airflow from electronic elements, utilizing a fan to guide airflow for effective heat dissipation while preventing water ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan is used to force airflow through openings in the housing for heat dissipation, then heat dissipation efficiency is improved, but electronic elements may be damaged by moisture ingress
Solution Approach 1:
The housing is divided into separate functional zones: an air inlet passage for cooling air entry, an air outlet passage for hot air discharge, and a drainage passage for moisture removal. This segmentation allows independent optimization of each function, enabling effective heat dissipation while preventing moisture damage to electronic elements.
Solution Approach 2:
The drainage passage acts as an intermediary structure that removes condensed moisture from the air flow path before it can reach electronic elements. The drainage hole positioned at the lowest point of the air inlet passage captures and removes water droplets, serving as a protective mediator between the cooling system and sensitive electronics.
2Volume of moving object
If the device size is reduced to achieve light weight and compact form factor, then portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The air flow path is configured to move in multiple dimensions within the compact housing: air enters through lateral inlet holes, flows downward and then forward through the accommodated space, and exits through rear outlet holes. This three-dimensional flow path maximizes heat dissipation efficiency within a minimized volume, allowing effective cooling without increasing device footprint.
3Temperature
If thermal fins are added to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity and volume increase
Solution Approach 1:
The patent extracts the heat dissipation function from complex thermal fin structures and implements it through a simplified forced convection system. A fan directly forces air flow through the housing, and the housing walls themselves serve as heat dissipation surfaces, eliminating the need for additional thermal fin components and reducing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency while maintaining device integrity by directing airflow to dissipate heat effectively and draining condensed water, thus extending the service life and operational efficiency of electronic devices in humid environments.
Implementation Method 1
A mechanism of forced convection needs to form openings on the housing of the power adaptor so as to guide airflow to flow there through and applies a fan to improve the efficiency of the heat dissipation
Implementation Method 2
When the power adaptor operates in a humid surrounding, the inner electronic elements may be damaged by mist flowing through the openings on the housing
Data Source
AI summary
A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.