Waterproof Structure for Electronic Device Heat Radiating Member
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Solution Overview
Problem
Existing electronic devices face challenges in achieving a waterproof structure while maintaining design aesthetics and functionality, particularly in miniaturized devices where the integration of waterproof components is complex and often compromises the use of materials vulnerable to moisture.
Innovation Solution
The implementation of a waterproof structure in electronic devices involves the use of seal members and waterproofing filling members, which are strategically arranged between the display module and the housing, allowing for the minimization of the Black Matrix region and enabling the use of materials like graphite for heat radiation without compromising the waterproof integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If seal members and waterproofing filling members are added to achieve waterproof function, then waterproof reliability is improved, but device complexity increases
Solution Approach 1:
The waterproof structure is segmented into multiple functional components: seal members (first and second seal members) positioned at different locations, waterproofing filling members, and non-waterproof members. This segmentation allows each component to perform its specific waterproof function independently, achieving comprehensive waterproof protection while maintaining clear functional boundaries and facilitating easier assembly and maintenance.
2Reliability
If waterproof components are integrated in miniaturized devices, then waterproof function is achieved, but manufacturing complexity increases
Solution Approach 1:
The non-waterproof members are positioned and secured in place before the waterproofing filling members are added. This preliminary arrangement ensures that the structural framework is established first, providing clear guidance for subsequent waterproof component integration. The seal members are also pre-positioned at specific locations, which simplifies the assembly process and reduces manufacturing complexity while ensuring proper waterproof function.
3Adaptability or versatility
If materials vulnerable to moisture are used, then design flexibility and functionality are improved, but waterproof integrity is compromised
Solution Approach 1:
The patent applies different quality characteristics to different regions: non-waterproof members (which may be made from materials vulnerable to moisture) are positioned in specific regions where they perform functional roles, while seal members and waterproofing filling members are strategically placed at critical interfaces and boundaries. This local differentiation allows vulnerable materials to be used where they provide design flexibility, while waterproof integrity is maintained at critical locations through specialized waterproof components.
4Shape
If Black Matrix region is minimized for design aesthetics, then display quality is improved, but waterproof arrangement space is reduced
Solution Approach 1:
The waterproof components are arranged in multiple dimensions and layers: seal members are positioned at different heights and locations, waterproofing filling members are placed in interstitial spaces, and non-waterproof members are arranged in overlapping configurations. This multi-dimensional arrangement allows comprehensive waterproof protection to be achieved within the minimized Black Matrix region, transforming the waterproofing strategy from a two-dimensional surface problem to a three-dimensional spatial solution.
Data Source
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AI summary
An electronic device including a waterproof structure is provided. The electronic device includes a housing, a window arranged in at least a part of the housing, a display module arranged in a rear surface of the window, a heat radiating member arranged in a rear surface of the display module, a polymer member arranged between a first surface of the heat radiating member and the rear surface of the display module, and a conductive member arranged in a second surface of the heat radiating member facing the first surface of the heat radiating member. A waterproof structure for the heat radiating member may be configured using at least one of the polymer member or the conductive member.