Waterproof Lamp Sealing Structure for Circuit Board Protection

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Solution Overview

Problem

Existing waterproof lamps face challenges in sealing the circuit board effectively, leading to reduced reliability and increased processing complexity, with adhesive-based sealing methods being inefficient and prone to defects.

Innovation Solution

A waterproof lamp design featuring a base and lens with a sealing structure that uses a seal ring and adhesive groove to securely encase the circuit board, eliminating the need for adhesive filling and enhancing structural reliability and waterproof performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If adhesive-based sealing methods are used to seal the circuit board, then the circuit board can be mounted in the accommodating cavity, but the sealing reliability is reduced and processing complexity increases

Engineering Contradiction:
Improvesealing process simplicityVSAvoidsealing reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent extracts the sealing function from the adhesive-based method and implements it through a dedicated sealing structure consisting of a sealing ring and adhesive groove. This separates the sealing function from the mounting process, eliminating the need for adhesive filling and drying steps while improving both ease of manufacture and sealing reliability through a mechanical sealing approach.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The sealing structure is segmented into distinct components: a sealing ring that forms the primary seal and an adhesive groove that provides additional sealing and structural support. This segmentation allows for simplified assembly where the circuit board is mounted without requiring adhesive filling, as the sealing is achieved through the structured sealing components rather than adhesive bonding.

Inventive Principle:
Principle #1Segmentation

2Productivity

If adhesive filling is used for sealing, then the circuit board can be secured, but the processing time increases due to adhesive drying requirements

Engineering Contradiction:
Improveassembly efficiencyVSAvoidadhesive drying time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The sealing structure is pre-configured with the sealing ring and adhesive groove formed as integral features of the base or lens assembly. This preliminary preparation eliminates the need for adhesive application and drying steps during assembly, as the sealing is achieved through the pre-formed mechanical structure. The circuit board can be directly mounted into the accommodating cavity without waiting for adhesive to dry, significantly improving productivity and eliminating time loss.

Inventive Principle:
Principle #10Preliminary action

3Device complexity

If a simple mounting structure is used, then the assembly process is simplified, but the waterproof performance is compromised

Engineering Contradiction:
Improvemounting structure complexityVSAvoidwaterproof performance
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by implementing a specialized sealing structure at the critical interface between the base and lens where waterproofing is most needed. The sealing ring and adhesive groove are positioned precisely at the mounting portion surrounding the circuit board, providing enhanced sealing exactly where water penetration would be most harmful. This localized sealing approach maintains overall structural simplicity while ensuring waterproof performance at the vulnerable interface.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The sealing structure combines different sealing mechanisms: a flexible sealing ring that provides elastic sealing and an adhesive groove that can accommodate sealing adhesive or form a mechanical interlock. This composite sealing approach integrates multiple sealing functions into a unified structure that maintains simplicity in the mounting process while ensuring comprehensive waterproof protection through the combination of elastic and adhesive/mechanical sealing elements.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS12259120B1Waterproof lamp
Publication Date: 2025.03.25 SIGNCOMPLEX LTD
  • US12259120B1 patent drawing
  • US12259120B1 patent drawing
  • US12259120B1 patent drawing

AI summary

The present disclosure provides a waterproof lamp, including: a base provided with a mounting portion and a first connecting portion; a circuit board arranged on the mounting portion; and a sealing structure arranged around the mounting portion, the sealing structure being arranged between the base and a lens and configured to seal a gap between the base and the lens so as to allow the circuit board to be mounted in an accommodating cavity in a sealed manner.