Waterproof Electronic Module Encapsulation via Retractable Mold Claws
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Solution Overview
Problem
Existing sealed electronic devices for receiving low-frequency waves, such as those used in motor vehicles, are vulnerable to bad weather conditions and require effective protection to maintain functionality.
Innovation Solution
A method involving an electronic module encapsulated in a flexible shell within a mold, where thermoplastic material is injected to form a rigid sealing shell, ensuring the module is protected from environmental factors, and a waterproof electronic device is created with a flexible shell surrounding the electronic sub-assembly and a rigid sealing shell for exterior mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic module is held at a distance from the mold walls using retaining lugs, then the electronic module is protected from direct contact with the mold, but the retaining lugs create gaps that may compromise the sealing integrity
Solution Approach 1:
The patent removes the retaining lugs from the final sealed product design. Instead of using mechanical retaining structures, the electronic module is directly embedded in the sealed housing, eliminating the gaps created by retaining lugs while maintaining protection through the encapsulating seal.
Solution Approach 2:
The patent merges the protective function and sealing function into a single integrated structure. The sealed housing directly encapsulates the electronic module without intermediate retaining structures, combining protection and sealing into one continuous barrier.
2Reliability
If the thermoplastic material is injected to completely surround the electronic module, then the sealing is improved, but the retaining lugs must be retracted during injection which complicates the molding process
Solution Approach 1:
The patent eliminates the retaining lugs entirely from the molding process design. Without retaining lugs, there is no retraction mechanism needed, simplifying the injection molding process while still achieving complete surrounding of the electronic module for waterproofing.
Solution Approach 2:
The electronic module is pre-positioned in the mold before injection, and the mold design inherently accommodates complete material injection without requiring dynamic retraction actions during the injection process.
3Device complexity
If the electronic module is placed directly in the mold without retaining lugs, then the structure is simplified, but the electronic module cannot be held at a distance from the mold walls during injection
Solution Approach 1:
The patent combines the positioning function with the final sealed structure. The electronic module is positioned in the mold and directly encapsulated, merging the positioning step with the sealing process, eliminating the need for separate retaining structures.
Solution Approach 2:
The injection molding process itself provides the positioning and securing function. As the thermoplastic material is injected, it automatically positions and secures the electronic module in its final position within the sealed housing, without requiring additional retaining mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a waterproof and durable electronic device capable of receiving low-frequency waves, maintaining functionality in adverse weather conditions, with the flexible shell protecting the electronic components during the hardening process and the rigid shell ensuring long-term impermeability.
Implementation Method 1
injecting into said mold a thermoplastic material suitable for hardening to form a sealing shell
Implementation Method 2
said flexible shell deforms during the hardening of said thermoplastic material
Data Source
Figure 1~3
Figure 4~5
AI summary
The invention relates to a method for obtaining a leaktight electronic device according to which provision is made for steps consisting in: a) placing an electronic module (3) inside a mould (100), b) holding said electronic module away from the walls (101) of said mould with the aid of holding claws (200) each exhibiting an end which protrudes towards the interior of the mould, c) injecting into said mould a thermoplastic material able to harden so as to form a leaktight shell, said holding claws retracting towards the exterior of the mould during the injection of said thermoplastic material.