Waterproof Electronic Packaging Structure with Interface Seal

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Solution Overview

Problem

The existing electronic packaging structures are prone to moisture permeation through the interface between the packaging material and the carrier plate, leading to reliability issues and potential failure over time.

Innovation Solution

A waterproof electronic packaging structure is developed, comprising a carrier plate with a substrate and leadframe, an encapsulating member that encapsulates the chip and chip bonding portion, and a waterproof member that covers the outer surface of the encapsulating member and the interface between it and the substrate, preventing moisture ingress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the chip is encapsulated with packaging material (epoxy or silicone), then the chip is protected and can be mounted, but moisture permeates through the interface between the packaging material and carrier plate over time, reducing reliability

Engineering Contradiction:

Improvereliability of electronic packaging structureVSAvoidmoisture permeation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The packaging structure is divided into distinct functional layers: a waterproof layer applied to the carrier plate, an encapsulating member that encapsulates the chip, and a sealant at the interface. This segmentation allows each layer to address specific protection needs, with the waterproof layer preventing moisture ingress at the carrier plate level and the sealant sealing the interface between the encapsulating member and carrier plate.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A waterproof layer is introduced as an intermediary between the carrier plate and the encapsulating member. This intermediate layer serves as a moisture barrier that prevents permeation through the interface, addressing the reliability issue without compromising the encapsulation function.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If a waterproof member is added to cover the interface between encapsulating member and substrate, then moisture penetration is prevented, but the device complexity increases

Engineering Contradiction:

Improvemoisture penetrationVSAvoidcomplexity of packaging structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The waterproof layer is integrated with the carrier plate structure, and the sealant is applied at the interface between existing components (encapsulating member and carrier plate). This merging approach incorporates waterproofing functionality into the existing packaging structure rather than adding completely separate components, thereby limiting the increase in device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10374104B2Waterproof electronic packaging structure and method for making the same

Publication Date: 2019.08.06 TONG HSING ELECTRONICS IND LTD

AI summary

A waterproof electronic packaging structure includes a carrier plate, a chip, an encapsulating member and a waterproof member. The carrier plate includes a substrate, and a leadframe partly embedded in the substrate and including a chip bonding portion exposed from the substrate. The chip is mounted to the substrate and is electrically connected to the chip bonding portion. The encapsulating member is formed on the carrier plate, and encapsulates the chip and the chip bonding portion. The waterproof member is formed on the encapsulating member, and covers an outer surface of the encapsulating member and an interface between the encapsulating member and the substrate. A method for making a waterproof electronic packaging structure is also disclosed.