Waterproof Printing Structure Adhesive Improvement Layer
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Solution Overview
Problem
Existing electronic devices with waterproof layers face challenges in securing a reliable attachment force and lamination properties, particularly on curved surfaces, leading to defects and increased production costs due to the use of attachment layers with unquantifiable bonding forces and mismatched material properties.
Innovation Solution
Incorporating an adhesive improvement layer with repeated patterns on the waterproof layer's contact surface, which improves attachment force quantification and reduces production costs by enhancing bonding between the waterproof layer and the opaque layer, while preventing stress concentration on curved surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an attachment layer with additives (acrylic resin and silicon beads) is applied to improve bonding force, then the attachment force between waterproof layer and printing structure is improved, but production costs increase and attachment force cannot be quantified
Solution Approach 1:
The invention changes the surface parameters of the printing structure by forming protrusions and recesses through controlled oxidation or plasma treatment, creating a microstructured surface that enhances bonding without requiring additional attachment layers with additives. This parameter change at the micro-scale achieves improved attachment force while maintaining manufacturing simplicity and enabling quantifiable attachment properties.
Solution Approach 2:
The invention replaces the mechanical/chemical approach of adding attachment layers with additives (acrylic resin and silicon beads) with a physical surface modification approach. By creating micro-protrusions and recesses on the printing structure surface, the bonding is achieved through mechanical interlocking and increased surface area, eliminating the need for additional material layers and their associated costs.
2Strength
If an attachment layer is applied to a cover plate including a curved surface, then attachment force is improved, but defects such as cracks or wrinkles are caused due to concentrated stress
Solution Approach 1:
The invention modifies the surface parameters of the printing structure by creating micro-protrusions and recesses that distribute stress more evenly across the bonding interface. This micro-structuring prevents stress concentration on curved surfaces, eliminating cracks and wrinkles while maintaining strong attachment force, thereby improving manufacturing precision without sacrificing bonding strength.
3Strength
If an attachment layer is used to bond waterproof layer and printing structure, then attachment force is improved, but delamination property deteriorates and maintenance/repair becomes difficult
Solution Approach 1:
The invention segments the bonding interface into multiple micro-level contact points through protrusions and recesses, creating a distributed bonding structure. This segmentation allows the bonding to occur at numerous small interfaces rather than one large interface, enabling controlled delamination for maintenance while maintaining overall attachment strength during normal operation.
4Adaptability or versatility
If materials with different densities and thermal expansion coefficients are used in the waterproof structure, then functional requirements are met, but interface stress increases causing defect rate to rise
Solution Approach 1:
The invention changes the physical parameters of the bonding interface by creating micro-protrusions and recesses that accommodate differential expansion and contraction between materials with different thermal expansion coefficients. This micro-structuring absorbs interface stress generated by material property mismatches, preventing defect formation while allowing the use of functionally appropriate materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive improvement layer with repeated patterns effectively sets and quantifies the attachment force, improving delamination properties for maintenance and repair, and reducing production costs by ensuring a strong yet manageable bond between the waterproof layer and the electronic device's components.
Implementation Method 1
an adhesive improvement layer formed on the second surface of the opaque layer and having repeated patterns; and a waterproof layer disposed between the adhesive improvement layer and the first surface and attached to the adhesive improvement layer and the first surface
Data Source
AI summary
An electronic device, according to various embodiments, may comprise: an outer housing comprising a front plate facing a first direction, a rear plate facing a direction opposite to the front plate, and a side member for surrounding a space between the front plate and the rear plate, wherein the side member protrudes toward the space and includes a protrusion having a first surface facing the first direction; an opaque layer disposed in the space so as to be parallel with the front plate and including a first portion located between the first surface and the front plate, wherein the first portion includes a second surface facing the first surface; an adhesiveness improvement layer formed on the second surface of the opaque layer and having a repetitive pattern; and a waterproof layer disposed between the adhesiveness improvement layer and the first surface and attached to the adhesiveness improvement layer and the first surface. Other various embodiments may be possible.