Waterproof Resin Molded LED Device for Moisture Resistance

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Light-emitting devices, particularly lamp-type LEDs, face issues with deterioration due to environmental factors, leading to reduced performance and reliability, especially in outdoor applications where moisture and humidity can affect their characteristics.

Innovation Solution

A light-emitting device design incorporating a resin package with a mold resin portion and a waterproof resin to protect the leads and light-emitting elements, featuring a specific geometry that minimizes moisture penetration and maintains light extraction efficiency, including a base portion and lens portions to control light distribution and resin flow during manufacturing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a lamp-type LED structure is used to achieve high frontward light distribution, then light extraction efficiency is improved, but the device becomes more susceptible to moisture and humidity affecting its characteristics

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidresistance to moisture and humidity
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The patent applies a waterproof resin coating that forms a protective film over the LED device. This thin film structure provides moisture barrier protection while maintaining the LED's light extraction efficiency, resolving the contradiction between optical performance and environmental resistance

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses a composite structure combining the LED device with a waterproof resin material. This composite approach integrates the optical functionality of the LED with the protective properties of the resin, achieving both high light extraction efficiency and resistance to moisture

Inventive Principle:
Principle #40Composite materials

2Reliability

If the LED device is sealed with resin to protect against moisture, then reliability is improved, but light extraction efficiency may deteriorate due to resin absorption or interference

Engineering Contradiction:
Improveprotection against moistureVSAvoidlight extraction efficiency
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The waterproof resin is applied selectively to specific areas of the LED device structure, providing localized protection where moisture exposure is most critical while minimizing the resin's impact on light extraction pathways. This selective application maintains optical performance while achieving environmental protection

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces deterioration and maintains high brightness and light distribution efficiency by using a waterproof resin to protect the device while ensuring efficient light extraction and minimizing the impact of moisture, enhancing the reliability of the light-emitting device for outdoor use.

Implementation Method 1

a plurality of lens portions positioned above the base portion and integrally formed with the base portion. The plurality of lens portions include a first lens portion overlapping, in a plan view, the first light-emitting element

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS20230095815A1Light-emitting device and method of manufacturing the same
Publication Date: 2023.03.30 NICHIA CORP
  • US20230095815A1 patent drawing
  • US20230095815A1 patent drawing
  • US20230095815A1 patent drawing

AI summary

Provided is a light-emitting device that can reduce deterioration of characteristics of the light-emitting device by using a waterproof resin.SolutionA light-emitting device includes a resin package including a lead, a resin member a light-emitting element, and a mold resin portion. The lead includes an exposed region exposed at the primary surface from the resin member. The light-emitting element is disposed in the exposed region of the lead. The mold resin portion includes a base portion having an upper surface positioned above a primary surface of the resin package and a lateral surface portion of the base portion covering a part of the lateral surface portion of the resin package and a lens portion that seal the light-emitting element. In a cross-sectional view, a first point is an outermost point of the upper surface of the base portion, the second point is an outermost point of the lateral surface portion of the base portion, and the light-emitting element is positioned closer to a back surface of the resin package than the first point and is positioned above the second point.