Waterproof Sealing for Bendable Display Electronic Devices
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Solution Overview
Problem
Existing electronic devices face challenges in maintaining a waterproof and dustproof structure due to the complexity of sealing members, particularly in areas where displays are bendable, leading to increased repair time and costs when the display is separated from the device.
Innovation Solution
A closed-loop sealing member is disposed along the perimeter of the electronic device's display, with a molded member extending obliquely to mitigate steps between covered and uncovered areas, eliminating the need for cure-in-place gaskets (CIPG) and allowing easy separation of the display for repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a CIPG is used to connect sealing members on the molded member, then waterproofing is improved, but repair complexity and time increase
Solution Approach 1:
The patent removes the CIPG component from the sealing structure, extracting the problematic element that caused repair difficulties. The sealing members are redesigned to be directly mountable on the molded member without requiring CIPG connection, thereby maintaining waterproofing while enabling easy display repair.
2Reliability
If multiple sealing members are arranged separately on the molded member, then waterproof coverage is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple sealing members into an integrated sealing structure that can be installed as a single unit on the molded member. This merging approach maintains comprehensive waterproof coverage while reducing the number of separate components and simplifying the overall sealing structure.
3Strength
If the molded member covers the bendable portion, then structural integrity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies different structural characteristics to different regions of the molded member. The bendable portion area is designed with specific local features that accommodate flexibility requirements, while other areas maintain rigid structural support. This localized differentiation maintains overall structural integrity without requiring uniformly high manufacturing precision across the entire molded member.
Data Source
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AI summary
An electronic device according to an embodiment of the disclosure may include a housing and a display disposed in the housing. The display may include a transparent layer, a display panel disposed on a rear surface of the transparent layer, at least one layer disposed on a rear surface of the display panel, and a bendable portion extending from the display panel, at least a part of the bendable portion being disposed on a rear surface of the layer. The electronic device may include a molded member at least partially covering the bendable portion, the molded member including an inclined portion inclined with respect to the rear surface of the layer. Various other embodiments may be possible.