Waterproof Thermopile Module with Selective Infrared Filter
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Solution Overview
Problem
Wearable devices equipped with thermopile modules for infrared temperature detection are prone to rust and damage due to moisture exposure, as they lack waterproofing.
Innovation Solution
A thermopile module design incorporating an outer case, circuit substrate, sensor chip, filter structure, and a waterproof structure that surrounds the filter and outer case, with a through hole for exposing the filter structure and preventing water ingress, ensuring the module remains dry and functional.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thermopile module is made open for infrared detection, then infrared temperature measurement is enabled, but moisture enters the device causing rust and damage
Solution Approach 1:
The patent applies a waterproof coating layer on the outer case and a waterproof seal between the filter structure and outer case, creating a protective barrier that blocks moisture while allowing infrared transmission. This flexible sealing approach resolves the contradiction by protecting internal components from moisture without blocking the infrared detection path.
Solution Approach 2:
The patent uses composite material structures including the waterproof coating layer combined with the outer case, and the filter structure with waterproof sealing. These composite structures provide both mechanical protection and infrared transparency while blocking moisture, thus resolving the contradiction between open design for detection and protection from harmful factors.
2Object-affected harmful factors
If the thermopile module is sealed waterproof, then moisture protection is achieved, but infrared heat energy cannot enter the sensor
Solution Approach 1:
The waterproof coating layer and seal structures are designed to be selectively permeable - blocking moisture molecules while allowing infrared radiation to pass through. This resolves the contradiction by creating a barrier that differentiates between harmful moisture and useful infrared energy based on their different physical properties.
Solution Approach 2:
The filter structure with waterproof sealing acts as an intermediary element between the external environment and the sensor. It mediates by selectively transmitting infrared radiation while blocking moisture, thus resolving the contradiction between protection and detection capability.
3Object-affected harmful factors
If a waterproof structure is added to the thermopile module, then moisture protection is improved, but device complexity increases
Solution Approach 1:
The patent uses thin waterproof coating layers applied to existing surfaces rather than adding bulky waterproof components. This approach provides effective moisture protection while minimizing additional structural complexity and maintaining a compact design suitable for wearable devices.
Solution Approach 2:
The waterproof coating layer is integrated with the outer case structure, and the waterproof seal is combined with the filter structure assembly. This merging of waterproofing functions with existing structural elements adds protection without proportionally increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The waterproof thermopile module effectively prevents moisture and dust from entering the device, maintaining its functionality and preventing rust, while allowing infrared heat energy to be accurately measured from ambient environments or object surfaces.
Implementation Method 1
measuring infrared temperature generated from an ambient environment or an object surface
Implementation Method 2
The filter structure is disposed above the sensor chip
Implementation Method 3
the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case
Implementation Method 4
The sensor chip is disposed on the circuit substrate
Data Source
AI summary
An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.


