Cu Wave Attenuator Stack With Cr-Ti Adhesion Layer
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Solution Overview
Problem
Existing electromagnetic wave attenuators face challenges in stably attenuating electromagnetic waves due to peeling issues between the conductive member and the base body, leading to instability in their shielding function.
Innovation Solution
The use of a stacked member with a base body featuring unevenness and a first layer composed of Cr and Ti, which enhances adhesion between the conductive member and the base body, along with additional layers and configurations to improve stability and attenuation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a simple conductive member structure is used, then manufacturing is easier, but adhesion between layers deteriorates causing peeling
Solution Approach 1:
The patent applies composite materials by creating a multi-layer structure consisting of a base body, an intermediate layer, and a conductive member. The intermediate layer acts as an adhesion promoter between the base body and the conductive member, preventing peeling while maintaining manufacturing simplicity. This composite approach resolves the contradiction by combining multiple materials with complementary properties.
Solution Approach 2:
The intermediate layer serves as an intermediary between the base body and the conductive member, providing a bonding interface that enhances adhesion. This mediator layer prevents direct contact between incompatible surfaces, eliminating peeling issues while keeping the overall structure simple and manufacturable.
2Reliability
If adhesion enhancement layers are added, then shielding stability improves, but device complexity increases
Solution Approach 1:
The patent uses a composite multi-layer structure where each layer has a specific function: the base body provides mechanical support, the intermediate layer provides adhesion, and the conductive member provides electromagnetic shielding. This functional composite approach achieves stable shielding without excessive complexity by assigning specific roles to each layer.
Solution Approach 2:
The intermediate layer is applied locally at the interface between the base body and conductive member, providing adhesion enhancement only where needed. This localized approach improves shielding stability without adding complexity to the entire device structure, as the enhancement is confined to the critical bonding region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and effective electromagnetic wave attenuator that can consistently suppress electromagnetic interference, enhancing the performance of electronic devices by improving adhesion and maintaining shielding effectiveness.
Implementation Method 1
a first layer provided between the first surface and the first conductive member, the first layer including Cr and Ti
Implementation Method 2
a first conductive member including Cu
Implementation Method 3
an electromagnetic wave attenuator includes a stacked member... capable of stably attenuating the electromagnetic wave
Data Source
AI summary
According to one embodiment, an electromagnetic wave attenuator includes a stacked member. The stacked member includes a base body including a first surface including unevenness, a first conductive member including Cu, and a first layer provided between the first surface and the first conductive member. The first layer includes Cr and Ti.