Integrated Circuit Wave Device Sublimation Cavity
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Solution Overview
Problem
Conventional integrated circuit wave devices require additional manufacturing steps and external wave directing components that are susceptible to damage and displacement, complicating the manufacturing process and affecting signal strength and directionality.
Innovation Solution
The method involves affixing an integrated circuit die to a substrate, forming a sublimatable material shape around it, creating a wave shaping member that conforms to this shape, and sublimating the material to create an internal cavity for wave directionality, allowing for improved signal focusing and protection within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external wave directing apparatus (lenses or reflectors) are positioned relative to the communication element, then signal strength and directionality are improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The wave directing function is merged with the package substrate by forming a wave shaping member directly on the substrate surface. This integration eliminates the need for separate external wave directing components and their associated positioning and affixation steps, thereby reducing device complexity while maintaining signal strength improvement.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the communication element and simultaneously acts as a wave directing structure through the integrated wave shaping member. This multi-functionality reduces the total number of components and simplifies the overall device architecture.
2Reliability
If wave directing apparatus are positioned external from the package, then signal focusing is improved, but manufacturing complexity increases
Solution Approach 1:
The wave shaping member is formed on the package substrate during the packaging process itself, before final assembly. This preliminary formation of the wave directing structure eliminates the need for subsequent positioning and affixation of separate wave directing components, simplifying manufacturing while maintaining signal focusing capability.
Solution Approach 2:
The wave directing function is combined with the packaging process by forming the wave shaping member directly on the substrate. This integration eliminates multiple separate manufacturing steps involving external components, thereby reducing manufacturing complexity while achieving signal focusing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, enhances device longevity by encapsulating sensitive components, and maintains signal strength and directionality without external components, improving the overall performance of integrated circuit wave devices.
Implementation Method 1
creating a form relative to the integrated circuit die and the substrate... forming a wave shaping member having a shape conforming at least in part to a shape of the form... sublimating the material to create an internal cavity
Data Source
AI summary
In described examples of forming an integrated circuit wave device, a method includes: (a) affixing an integrated circuit die relative to a substrate; (b) creating a form relative to the integrated circuit die and the substrate; and (c) forming a wave shaping member having a shape conforming at least in part to a shape of the form.