Wave-Profile Header for Cooler Thermal Shock Resistance

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Solution Overview

Problem

Coolers for motor vehicles are prone to damage from thermal shocks due to uneven expansion of coolant tubes, causing significant strain on joints between tubes and headers.

Innovation Solution

A profile for the header with a cross-sectional shape featuring at least two wave troughs and three wave crests, along with specific radius values and flat portions, improves the distribution of tension and enhances resistance to thermal shocks, allowing for a more secure soldered connection between the header and tubes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional smooth-profile headers are used, then manufacturing is simple, but resistance to thermal shocks is poor due to uneven strain distribution

Engineering Contradiction:
Improveresistance to thermal shocksVSAvoidprofile geometry complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The header profile incorporates wave-like curvature with multiple crests and troughs instead of a smooth geometry. This curvature distributes thermal strain more evenly across the joint between header and tubes, preventing stress concentration and improving resistance to thermal shocks by a factor of 2-3.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The invention changes the geometric parameters of the header profile by introducing specific wave characteristics (at least two wave troughs and three wave crests with defined radius ratios). This parameter modification transforms the stress distribution pattern, converting concentrated stress into distributed stress across the thermal shock interface.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If wave-shaped profile with specific radiuses is implemented, then thermal shock resistance improves by 2-3 times, but manufacturing precision requirements increase

Engineering Contradiction:
Improvethermal shock resistanceVSAvoidwave radius precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent defines specific parameter ranges for wave radiuses (R1-R5) with clear relationships between them. These parameter specifications provide manufacturing guidance while achieving the desired thermal shock resistance, balancing precision requirements with performance benefits.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly improves resistance to thermal shocks by a factor of 2-3, ensuring a durable and long-term resistant joint, as demonstrated by extensive testing.

Implementation Method 1

there are considerable temperature differences between individual tubes, such that the tubes expand differently, which results in considerable strain on the joints between the tubes and the header

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

this results in a better distribution of the tension, so that resistance to thermal shocks is considerably improved

Methodology Applied
Scientific EffectStress distribution:

Data Source

PatentEP3977035B1A profile for a header of a cooler, a header having such a profile and a cooler having a header
Publication Date: 2024.05.08 HANON SYST CO LTD
  • EP3977035B1 patent drawingFigure 1~3
  • EP3977035B1 patent drawingFigure 4~6
  • EP3977035B1 patent drawingFigure 7~8+

AI summary

The invention relates to a profile (10) for a header of a cooler which also comprises numerous parallel tubes, having a cross-sectional shape between slots for the tubes which comprises at least two wave troughs (12), and to a header having such a profile and a cooler having such a header.