Multilayer Substrate With Wave-Shaped Periphery For Noise Suppression
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Solution Overview
Problem
The existing multilayer substrate production techniques for millimeter-wave or microwave radio transmitter-receiver modules have limited flexibility in production methods due to the requirement of metal plating on the substrate before mounting electronic components or ICs, which restricts the order of production steps and reduces noise suppression effectiveness.
Innovation Solution
A multilayer substrate with a wave-shaped outer periphery, where the substrate is processed after mounting electronic components or ICs, allowing for increased flexibility in production and effective noise suppression by scattering and reflecting noise through the varying wave shape, thereby reducing interference and noise levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metal plating is performed on the substrate before mounting electronic components, then noise suppression is achieved, but the production method has limited flexibility and restricted step ordering
Solution Approach 1:
The patent inverts the conventional production sequence by performing metal plating after mounting electronic components on the substrate, rather than before. This reversal resolves the technical contradiction by enabling noise suppression through plating while simultaneously allowing flexible production method ordering, as the plating step can now be performed at a later stage in the manufacturing process.
2Object-affected harmful factors
If metal plating is performed on the substrate, then noise suppression is achieved, but the production process complexity increases due to additional plating steps
Solution Approach 1:
By inverting the production sequence to perform plating after component mounting, the patent reduces production process complexity. The plating step becomes a post-assembly treatment rather than a pre-assembly requirement, allowing manufacturers to integrate it into existing production workflows without adding significant process complexity.
3Adaptability or versatility
If the substrate is processed with wave shape after mounting components, then production flexibility is increased, but the manufacturing precision requirements increase
Solution Approach 1:
The patent performs wave shape processing after component mounting, which allows for greater production flexibility. By inverting the sequence, the wave shaping can be applied to the completed assembly rather than requiring precise pre-alignment during substrate preparation, thereby reducing the stringency of manufacturing precision requirements while maintaining the desired wave shape characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the degree of freedom in production methods and achieves significant noise damping without the need for metal plating, effectively suppressing noise levels and ensuring signal integrity in transmitter-receiver modules.
Implementation Method 1
effective noise suppression by scattering and reflecting noise through the varying wave shape
Implementation Method 2
effective noise suppression by scattering and reflecting noise through the varying wave shape
Data Source
AI summary
Realized is a multilayer substrate and a multilayer substrate array, each of which has a high degree of freedom in a production method. At least part of an outer periphery (51) of a multilayer substrate (100), which includes a wiring provided on an inner layer, is processed so as to have a wave shape.