Wave Solder Nozzle Exit Wing Actuation for Solder Flow Control
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Solution Overview
Problem
Manual adjustment of exit wings in typical wave solder nozzles is difficult and risky for operators, affecting the control of solder flow during the wave soldering process for printed circuit boards.
Innovation Solution
A wave soldering machine with a wave solder nozzle assembly featuring a rotatable exit wing adjusted by a linear actuator and linkage system, allowing for real-time control of the exit wing's orientation to optimize solder flow, and a gas-impermeable shroud for a controlled atmosphere.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual adjustment of exit wing is used, then device complexity is reduced, but ease of operation deteriorates and reliability worsens due to operator risk
Solution Approach 1:
The patent replaces the manual mechanical adjustment system with an automated electromechanical system. A linear actuator is connected to the exit wing through a linkage mechanism, enabling automated control of the exit wing position. This substitution eliminates manual intervention while providing precise, repeatable adjustment capability, thereby improving ease of operation without significantly increasing overall device complexity.
Solution Approach 2:
The automated adjustment system allows the wave solder nozzle assembly to self-regulate solder flow by automatically positioning the exit wing. The system can respond to process conditions and adjust the exit wing position without external operator intervention, making the system self-sufficient and improving operational ease while maintaining controlled complexity.
2Reliability
If manual adjustment of exit wing is used, then device complexity is reduced, but reliability worsens due to operator risk in molten solder
Solution Approach 1:
The patent replaces manual mechanical adjustment with an automated electromechanical system using a linear actuator and linkage. This eliminates operator exposure to molten solder hazards while providing reliable, repeatable exit wing positioning. The automated system enhances reliability by removing human error and safety risks associated with manual adjustment in the hazardous solder pot environment.
3Productivity
If automated adjustment is implemented, then ease of operation improves, but device complexity increases
Solution Approach 1:
The patent implements automated adjustment by replacing manual operation with an electromechanical system consisting of a linear actuator and linkage mechanism. This automation improves productivity by enabling rapid, precise adjustment of the exit wing position and allowing for consistent solder flow control. The complexity increase is localized to the actuation mechanism while the overall system remains manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Automated adjustment of the exit wing ensures precise control over solder flow, reducing operator risk and improving the efficiency and consistency of the soldering process, while maintaining a controlled environment to prevent contamination.
Implementation Method 1
a linear actuator connected to the exit wing and configured to adjust an orientation of the exit wing with respect to the nozzle core frame
Implementation Method 2
The exit wing is rotatable about a hinge with respect to the nozzle core frame to adjust a flow of a solder wave
Implementation Method 3
the linkage includes at least one rotating link having a first end rotatably coupled to the second end of the exit wing and a second end that is rotatably coupled to an actuator arm of the actuator
Data Source
AI summary
A wave soldering machine includes a housing and a conveyor configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and a wave solder nozzle assembly configured to create a solder wave. The wave solder nozzle assembly has a nozzle core frame and an exit wing, the exit wing being rotatable about a hinge with respect to the nozzle core frame to adjust a flow of a solder wave. A linear actuator is connected via a linkage to the exit wing to allow the linear actuator to adjust an orientation of the exit wing with respect to the nozzle core frame.