Wave Soldering Nozzle Assembly for Adjustable Solder Wave Width

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Solution Overview

Problem

Existing wave soldering machines face challenges in adjusting solder flow effectively, which can be hazardous for operators and results in excessive dross formation.

Innovation Solution

The wave soldering machine incorporates a wave soldering nozzle assembly with a solder distribution baffle and movable nozzle plates, controlled by actuators and a controller, to adjust the width of the solder wave and minimize dross.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If manual adjustment of solder flow is performed, then operator flexibility is maintained, but operator safety is compromised and dross formation increases

Engineering Contradiction:
Improveoperator flexibilityVSAvoidoperator safety
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent replaces manual mechanical adjustment with an automated control system that uses sensors to detect solder wave characteristics and actuators to adjust nozzle plate positions, eliminating the need for operators to manually reach into the solder pot

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces intermediary components including sensors that detect solder wave parameters and controllers that process this information to automatically adjust nozzle plates, serving as intermediaries between the solder flow and operator control

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If manual adjustment of solder flow is performed, then operator flexibility is maintained, but dross formation increases

Engineering Contradiction:
Improveoperator flexibilityVSAvoiddross formation
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The patent implements a feedback control system where sensors continuously monitor solder wave characteristics and provide information to the controller, which automatically adjusts nozzle plate positions to maintain optimal solder flow and minimize dross formation

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent replaces manual mechanical adjustment with an automated control system that uses sensors to detect solder wave characteristics and actuators to adjust nozzle plate positions, eliminating the need for operators to manually reach into the solder pot

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Area of stationary object

If solder wave width is not controlled, then soldering coverage is maximized, but dross formation increases

Engineering Contradiction:
Improvesoldering coverageVSAvoiddross formation
Core Design Contradiction:
Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The patent employs dynamically adjustable nozzle plates that can change their position to control solder wave width, allowing the system to adapt the soldering coverage area while maintaining optimal flow characteristics to minimize dross

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the physical parameters of solder flow by adjusting nozzle plate positions to control wave width, optimizing both coverage area and flow characteristics to reduce dross formation

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for precise control of the solder wave width, reducing dross formation and enhancing operator safety by automating the adjustment process.

Implementation Method 1

The pump impeller is coupled to a controller to control the flow of solder provided by the pump impeller

Methodology Applied
Scientific EffectCentrifugal force: Centrifugal Force

Data Source

PatentEP4541495A1System and method for controlling the width of the solder flow in a wave soldering machine
Publication Date: 2025.04.23 ILLINOIS TOOL WORKS INC
  • EP4541495A1 patent drawingFigure 1
  • EP4541495A1 patent drawingFigure 2
  • EP4541495A1 patent drawingFigure 3

AI summary

A wave soldering machine is configured to perform a wave soldering operation on a printed circuit board. The wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave. The wave soldering nozzle assembly is configured to control a width of the solder wave through the solder distribution baffle to produce a maximum width solder wave and a minimum width solder wave.