Wave Spring Interconnect Probes for Fine-Pitch Signal Integrity
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Solution Overview
Problem
Socket pin-based interconnects with coil spring designs face challenges in fine pitch designs and durability issues, making them difficult to implement effectively.
Innovation Solution
Incorporation of wave spring structures composed of stacked metal discs with pre-bent wave profiles or wound flat metal string discs, providing improved signal integrity, reduced compressed height, adjustable interconnect impedance, and diversified magnetic fields through parallel current paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If coil spring designs are used in socket pin-based interconnects, then mechanical stability is maintained, but implementation in fine pitch designs becomes difficult
Solution Approach 1:
The patent changes the fundamental geometric parameters of the spring structure from a traditional coil configuration to a wave spring configuration with specific wave profiles (sinusoidal, triangular, trapezoidal). This parameter change enables the interconnect to achieve fine pitch designs with reduced overall height while maintaining the necessary mechanical stability and electrical performance
Solution Approach 2:
The wave spring structure introduces a new dimensional approach by stacking multiple thin disc layers with wave profiles, creating a compressed height advantage. This dimensional reconfiguration allows the interconnect to fit within tighter pitch constraints while maintaining structural integrity through the stacked layer architecture
2Reliability
If coil spring designs are used in socket pin-based interconnects, then structural support is provided, but durability is reduced
Solution Approach 1:
The wave spring structure functions as a composite structure by stacking multiple thin disc layers, each contributing to the overall structural support. This composite approach distributes mechanical stresses across multiple layers and contact points, enhancing durability while maintaining the necessary structural strength for socket pin-based interconnects
Solution Approach 2:
The spring structure is segmented into multiple discrete wave spring discs stacked together, with each disc providing individual contact points and structural support. This segmentation allows for better stress distribution and improved durability compared to a single continuous coil structure, as each disc can independently accommodate mechanical loads
3Reliability
If traditional spring structures are used, then assembly is simplified, but signal integrity is compromised due to crosstalk
Solution Approach 1:
The wave spring structure introduces local magnetic field diversification through its unique wave profile geometry, creating localized field patterns that mitigate crosstalk between adjacent interconnects. This local quality enhancement improves signal integrity without requiring changes to the overall assembly process or manufacturing approach
Solution Approach 2:
By changing the geometric parameters of the spring structure to wave profiles with specific characteristics, the patent achieves improved signal integrity through reduced crosstalk. The wave profile parameters are optimized to create favorable magnetic field distributions that minimize interference with adjacent signals while maintaining manufacturing simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Wave spring structures enhance signal integrity by mitigating crosstalk, reduce contact resistance, and simplify assembly, while maintaining mechanical stability and reducing component counts.
Implementation Method 1
wave spring structures may provide improved signal Integrity by mitigating crosstalk with a diversified magnetic field to adjacent finer-pitch conductors
Implementation Method 2
a spring structure that is composed of stacked metal discs with pre-bent wave profiles or wound flat metal string discs
Data Source
AI summary
In one embodiment, an interconnect apparatus (e.g., an interposer apparatus) includes a plurality of interconnect probes that each include a wave spring structure that includes a plurality of stacked wave spring discs. The wave spring discs may be formed in a sinusoidal wave form shape, or in another wave form shape.