Waveguide Coupling Layers With Air Passages for PCB Cooling
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Solution Overview
Problem
Existing solutions for antenna elements, particularly phased arrays, face challenges in implementing effective signal filtering and cooling due to bulkiness, high costs, and inefficient cooling mechanisms that obstruct airflow, leading to potential overheating issues.
Innovation Solution
A waveguide arrangement that integrates ventilation by stacking waveguide layers with coupling layers, which include air passages and pins to allow air flow for cooling, while also incorporating antenna elements and filtering capabilities, enabling efficient electromagnetic signal filtering and forced ventilation through fan-assisted airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing cooling solutions are used, then cooling function is provided, but the system becomes bulky and expensive
Solution Approach 1:
The patent combines the cooling function with the waveguide structure by integrating air passages directly into the coupling layers between waveguide layers. This merging eliminates the need for separate cooling components, reducing overall system volume while maintaining effective cooling functionality.
Solution Approach 2:
The coupling layers serve dual purposes: they provide electromagnetic coupling between waveguide layers and simultaneously function as cooling channels. This multi-functionality reduces the number of separate components needed, making the system more compact and cost-effective.
2Temperature
If existing cooling solutions are used, then cooling function is provided, but manufacturing cost increases
Solution Approach 1:
By integrating cooling passages into the existing coupling layers, the patent eliminates the need for separate cooling component manufacturing and assembly. This reduces manufacturing complexity and cost while maintaining effective cooling.
Solution Approach 2:
The coupling layers perform both electromagnetic coupling and cooling functions, reducing the total component count and associated manufacturing costs. This multi-functional design simplifies production while maintaining cooling effectiveness.
3Temperature
If cooling components are added, then cooling function is improved, but device complexity increases
Solution Approach 1:
The cooling passages are integrated into the coupling layers, eliminating the need for separate cooling components and their associated mounting, sealing, and connection systems. This reduces device complexity while maintaining cooling functionality.
Solution Approach 2:
The coupling layers serve dual purposes as both electromagnetic coupling elements and cooling channels, reducing the number of separate components and simplifying the overall system architecture.
4Temperature
If ventilation is not integrated, then waveguide structure is simple, but heat dissipation is insufficient
Solution Approach 1:
Ventilation channels are merged with the waveguide coupling structure, allowing heat dissipation without adding separate ventilation components. The air passages in the coupling layers provide both structural function and thermal management.
Solution Approach 2:
The coupling layers provide multiple functions including electromagnetic coupling, structural support, and thermal management through integrated air passages, reducing the need for additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a compact, lightweight, and cost-effective cooling system that effectively manages heat dissipation and filtering functions, enhancing the reliability and performance of antenna elements by integrating ventilation and filtering within the waveguide structure.
Implementation Method 1
The coupling layer (15, 17, 18) comprises air passages (16) that enable air to pass through the coupling layers (15, 17, 18)
Implementation Method 2
Each waveguide layer (3, 4, 5, 6) in turn comprises a plurality of air-filled waveguide conducting tubes (7, 8, 9, 10, 11, 12), each air-filled waveguide conducting tube (7, 8, 9, 10, 11, 12) having an electrically conducting inner wall (13)
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
The present disclosure relates to a waveguide arrangement (1, 1') comprising a mounting printed circuit board (2), PCB, and at least a first waveguide layer (4). Each waveguide layer (3, 4, 5, 6) comprises at least a first waveguide conducting tube (7, 8, 9, 10, 11, 12), each waveguide conducting tube (7, 8, 9, 10, 11, 12) having an electrically conducting inner wall (13). The PCB (2) comprises a signal interface (14) for each waveguide conducting tube (7, 8, 9, 10, 11, 12). The waveguide arrangement (1, 1') further comprises at least a first coupling layer (15) that is positioned between the PCB and the first waveguide conducting tube such that at least the first waveguide conducting tube (7, 8, 9, 10, 11, 12) of the first waveguide layer (4) is connected to the corresponding signal interface (14) via the first coupling layer (15). Each coupling layer (15) comprises air passages (16, 16a, 16b) that enable air to pass through the coupling layer (15).