Optical Waveguide Alignment via Carrier Substrate Markup Sets
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Solution Overview
Problem
Current methods for aligning waveguides in optical systems, such as those used in photonic integrated circuits, are complex, costly, and face challenges with miniaturization due to stringent manufacturing tolerances, especially for edge-emitting components where precise optical coupling is required.
Innovation Solution
The use of a carrier substrate with a markup set that allows for precise alignment of optical components by detecting the relative position and orientation of the markup sets using a measuring device, enabling simple and cost-effective passive alignment of waveguides, which can be optically, electrically, or magnetically detected.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active alignment methods using light signal measurement are used to achieve precise waveguide coupling, then optical coupling efficiency is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent introduces an intermediary alignment mark structure that mediates between the waveguide and substrate. This alignment mark serves as a reference that can be detected by the measuring device, enabling precise alignment without requiring complex direct measurement of waveguide positions. The alignment mark translates the alignment task into a simpler detection problem.
Solution Approach 2:
The patent replaces complex mechanical active alignment systems with a simpler optical measurement system. Instead of using mechanical positioning devices and complex feedback mechanisms, the invention uses optical detection of alignment marks combined with a control system to achieve precise alignment, thereby reducing mechanical complexity.
2Device complexity
If passive alignment methods without light signal measurement are used to simplify the manufacturing process, then device complexity is reduced, but manufacturing precision deteriorates due to stringent tolerance requirements
Solution Approach 1:
The patent applies preliminary action by pre-defining alignment marks with specific geometries and positions during the substrate preparation phase. These alignment marks are created in advance with high precision, so that during the actual waveguide placement, the alignment task is simplified to matching the waveguide with the pre-defined mark, rather than requiring high-precision direct positioning.
Solution Approach 2:
The patent uses alignment marks as simplified copies or representations of the desired waveguide positions and orientations. Instead of directly measuring and positioning waveguides with high precision, the system creates and detects copies (alignment marks) that encode the alignment information, making the measurement and alignment process more manageable.
3Manufacturing precision
If heterogeneous integration methods with semiconductor bonding are used to achieve good alignment precision, then manufacturing precision is improved, but productivity decreases due to process restrictions and low yield
Solution Approach 1:
The patent segments the alignment and integration process into independent stages: substrate preparation with alignment marks, waveguide fabrication, and alignment/detection phase. This segmentation allows each stage to be optimized independently and enables parallel processing, improving overall productivity while maintaining precision through the persistent alignment marks that guide subsequent steps.
Data Source
AI summary
Disclosed is a system for and a method of manufacturing of an optical system, including a first optical component, comprising a first waveguide and a carrier substrate, wherein the first optical component is arranged on the carrier substrate. The first optical component comprises a first markup set having a defined position/orientation with respect to the first waveguide, the carrier substrate has a second markup set detectable based on a relative position/orientation of the first and second markup sets when a desired orientation of the first waveguide relative to the carrier substrate is achieved in a reference plane extending parallel to a surface of the carrier substrate.