Waveguide Antenna in Semiconductor Package
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Solution Overview
Problem
Conventional semiconductor packaging for wireless communication devices incurs high manufacturing costs and hinders compact design due to separate manufacturing and electrical connection of antennas and communication modules, especially at millimeter wave frequencies where circuitry complexity increases with short wavelengths.
Innovation Solution
A semiconductor package integrating a substrate with a chip, grounding layer, encapsulant, conductive via, and shielding layer forming a waveguide antenna, where the conductive via transmits RF signals and the shielding layer is electrically connected to the conductive elements, allowing for compact design and efficient RF signal emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the antenna and communication module are separately manufactured and connected on the circuit board, then manufacturing flexibility is maintained, but manufacturing costs increase and device size cannot be reduced
Solution Approach 1:
The patent merges the antenna and communication module into a single integrated semiconductor package. The antenna is formed within the package structure using conductive vias, grounding layers, and shielding layers that are manufactured together with the communication module, eliminating the need for separate manufacturing and assembly processes.
2Reliability
If conventional separate manufacturing approach is used, then component reliability is maintained, but manufacturing costs are higher
Solution Approach 1:
The integrated manufacturing process combines the antenna structure with the communication module fabrication steps. The antenna components (conductive vias, grounding layers, shielding layers) are formed using the same semiconductor manufacturing processes as the module, reducing overall manufacturing cost while maintaining reliability through integrated quality control.
3Length of moving object
If millimeter wave frequencies are used, then antenna physical size can be small, but circuitry fabrication becomes very difficult
Solution Approach 1:
The patent replaces conventional planar circuitry with a three-dimensional waveguide structure formed by conductive vias, grounding layers, and shielding layers. This waveguide approach enables millimeter wave signal transmission while avoiding the fabrication difficulties of high-frequency planar circuits, as the waveguide structure can be manufactured using standard semiconductor processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces manufacturing costs and enables compact design while effectively transmitting RF signals, improving device performance at millimeter wave frequencies by forming a waveguide antenna within the package.
Implementation Method 1
a conductive via extending from an upper surface of the encapsulant to the grounding layer... The conductive via is useable to transmit a radio frequency signal
Implementation Method 2
at least one signal emitting opening in the encapsulant exposing a cavity defining a waveguide... effectively transmitting RF signals, improving device performance at millimeter wave frequencies by forming a waveguide antenna within the package
Data Source
AI summary
A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.