Waveguide Attenuator With Airgap And Shallow Trench Isolation

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Solution Overview

Problem

Semiconductor optical waveguide structures face issues with signal leakage and crosstalk due to open or unconnected ports, which can cause interference and reduce the efficiency of photonic devices.

Innovation Solution

A waveguide structure with a self-aligned attenuator and airgap structure, integrated with shallow trench isolation, using semiconductor materials like Ge or SiGe, and clad with dielectric material to minimize signal loss and interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If Ge absorber material is used to prevent signal leakage and backscatter, then signal loss is reduced, but device complexity increases due to integration requirements

Engineering Contradiction:
Improvesignal lossVSAvoiddevice complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The waveguide structure merges multiple functions into a single integrated component: the Ge absorber layer is directly integrated into the waveguide structure to simultaneously provide optical confinement and absorption of leaked signals, while the doped semiconductor layer provides both mechanical support and additional absorption functionality. This integration eliminates the need for separate absorber components, reducing device complexity while maintaining signal loss prevention.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The waveguide structure employs multi-functional layers that serve multiple purposes: the Ge layer provides both optical absorption and structural integration, the doped semiconductor layer provides mechanical support, electrical properties, and additional absorption, and the airgap provides both optical isolation and physical separation. This multi-functionality reduces the number of discrete components needed, addressing the device complexity issue while maintaining energy loss prevention.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Device complexity

If open ports are left unconnected in photonic devices, then device simplicity is maintained, but signal leakage and crosstalk increase causing interference

Engineering Contradiction:
Improvedevice simplicityVSAvoidsignal leakage and crosstalk
Core Design Contradiction:
Device complexityVSObject-generated harmful factors

Solution Approach 1:

The waveguide structure converts potentially harmful signal leakage into a beneficial absorption mechanism. The Ge absorber layer and doped semiconductor layer are positioned to capture signals that would otherwise leak from open ports or undergo backscatter, converting these harmful leakage paths into useful energy dissipation zones. This approach maintains device simplicity while eliminating the harmful effects of open ports.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The structure implements preliminary anti-action by incorporating absorber layers that proactively counteract signal leakage before it can cause harmful effects. The Ge and doped semiconductor layers are positioned to intercept and absorb leaked signals at their source, preventing backscatter and crosstalk before they can interfere with other photonic devices. This preventive approach maintains simple device architecture while eliminating harmful interference.

Inventive Principle:
Principle #9Preliminary anti-action

3Reliability

If absorber material is integrated into waveguide structure, then signal leakage is prevented, but manufacturing precision requirements increase

Engineering Contradiction:
Improvesignal leakage preventionVSAvoidmanufacturing precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The waveguide structure utilizes parameter changes in material properties to achieve reliable signal leakage prevention with manageable manufacturing precision. By varying the doping concentration in the semiconductor layer and controlling the thickness of the Ge absorber layer, the structure optimizes absorption efficiency while maintaining compatibility with standard fabrication processes. These parameter adjustments allow reliable performance without requiring extreme manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The structure employs composite materials combining Ge and doped semiconductor layers, each contributing different properties that complement each other. The Ge layer provides high optical absorption coefficient, while the doped semiconductor layer provides mechanical compatibility with the waveguide and additional absorption through free carrier absorption. This composite approach achieves reliable signal leakage prevention through material property synergy rather than relying solely on precise geometric dimensions, thereby reducing manufacturing precision requirements.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces signal leakage and crosstalk, achieving absorption levels greater than 30 dB, enhancing the performance and integration of photonic devices in compact form factors.

Implementation Method 1

Ge is a commonly utilized absorber material in the fabrication of photonic devices... achieving absorption levels greater than 30 dB

Methodology Applied
Scientific EffectAbsorption (EM radiation): Absorption (EM radiation)

Data Source

PatentUS11422303B2Waveguide with attenuator
Publication Date: 2022.08.23 GLOBALFOUNDRIES US INC
  • US11422303B2 patent drawing
  • US11422303B2 patent drawing
  • US11422303B2 patent drawing

AI summary

The present disclosure relates to semiconductor structures and, more particularly, to a waveguide structure with attenuator and methods of manufacture. The structure includes: a waveguide structure including semiconductor material; an attenuator underneath the waveguide structure; an airgap structure vertically aligned with and underneath the waveguide structure and the attenuator; and shallow trench isolation structures on sides of the waveguide structure and merging with the airgap structure.