Optical Waveguide Substrate Bonding for Thermal and DC Drift

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Solution Overview

Problem

Existing optical waveguide devices face issues with both temperature drift due to thermal stress and DC drift caused by differences in linear expansion coefficients and the presence of movable carriers or polar groups, which are not adequately addressed by prior adhesives and resin substrates.

Innovation Solution

The optical waveguide device employs a lithium niobate or lithium tantalate substrate with anisotropic thermal expansion, joined to a lower-dielectric α-quartz single crystal holding substrate, ensuring minimal differences in linear expansion coefficients and minimizing the use of adhesives to suppress both temperature and DC drift.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the optical waveguide substrate is thinned to reduce drive voltages and broaden bandwidth, then the device performance is improved, but peeling or cracking occurs due to internal stress from thermal expansion differences

Engineering Contradiction:
Improvedrive voltageVSAvoidsubstrate integrity
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The patent changes the material parameters of the holding substrate by selecting a material whose linear expansion coefficient closely matches that of the thinned optical waveguide substrate. This parameter matching reduces thermal expansion differences, thereby suppressing internal stress and preventing peeling or cracking while maintaining the thinned substrate configuration

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The holding substrate acts as an intermediary element that supports the thinned optical waveguide substrate. By carefully selecting the holding substrate material to have similar thermal expansion properties, it mediates the thermal stress between the thinned substrate and the low-dielectric constant layer, preventing damage

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If a low-dielectric constant layer is disposed below the optical waveguide to broaden bandwidth, then the device performance is improved, but temperature drift occurs due to thermal expansion differences

Engineering Contradiction:
ImprovebandwidthVSAvoidtemperature stability
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The patent modifies the thermal expansion parameters of the holding substrate to match those of both the optical waveguide substrate and the low-dielectric constant layer. This parameter optimization suppresses temperature drift caused by thermal expansion mismatches while maintaining the bandwidth-enhancing low-dielectric constant layer configuration

Inventive Principle:
Principle #35Parameter changes

3Strength

If adhesive materials are used to attach the optical waveguide substrate and low-dielectric constant layer, then the bonding strength is improved, but DC drift occurs due to movable carriers or polar groups in the adhesive

Engineering Contradiction:
Improvebonding strengthVSAvoidelectrical stability
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent extracts and removes the problematic adhesive layer containing movable carriers or polar groups from the device structure. Instead of using conventional adhesives, it employs direct bonding or alternative attachment methods that eliminate the source of DC drift while maintaining adequate bonding strength through mechanical interlocking or surface treatment

Inventive Principle:
Principle #2Taking out (Extraction)

4Ease of manufacture

If resin substrates are used as holding substrates to suppress thermal stress, then the ease of manufacture is improved, but DC drift occurs due to polar groups in the resin material

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidelectrical stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent removes the resin holding substrate that contains polar groups causing DC drift. It replaces the resin substrate with alternative holding structures that provide mechanical support without introducing electrical instability, while maintaining manufacturing simplicity through direct bonding techniques or simplified assembly processes

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces both temperature and DC drift phenomena, maintaining substrate integrity and performance under thermal stress and electrical bias, enhancing device durability and stability.

Implementation Method 1

an optical waveguide substrate that has an electro-optic effect

Methodology Applied
Scientific EffectElectro-optic effect: Electro-Optic Effects

Implementation Method 2

an optical waveguide substrate that is a crystal having anisotropy in thermal expansion rate

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

a crystal having anisotropy in thermal expansion rate

Methodology Applied
Scientific EffectAnisotropy: Anisotropy

Data Source

PatentEP3842844B1Optical waveguide device
Publication Date: 2026.01.28 SUMITOMO OSAKA CEMENT CO LTD
  • EP3842844B1 patent drawingFigure 1~3

AI summary

An optical waveguide device including an optical waveguide substrate that has an electro-optic effect, is a crystal having anisotropy in thermal expansion rate, has a thickness set to 10 µm or lower, and includes an optical waveguide and a holding substrate that holds the optical waveguide substrate, the optical waveguide substrate and the holding substrate being joined to each other, in which the holding substrate is formed of a crystal having a lower dielectric constant than the optical waveguide substrate and having anisotropy in thermal expansion rate, and the optical waveguide substrate and the holding substrate are joined to each other such that differences in thermal expansion rate between the optical waveguide substrate and the holding substrate become small in different axial directions on a joint surface.