Waveguide Identification Pattern for Diced Photonics Chips
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Solution Overview
Problem
Silicon photonics chips lack electrical probing capabilities, making it impossible to track and identify individual dies after dicing from the wafer.
Innovation Solution
Implementing a grating coupler with damaged regions visible only in infrared light, created using an external laser to induce scattering spots in unique patterns on waveguide structures, enabling identification through an infrared camera and decoder system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If electrical fuses are used for chip identification, then electrical probing can be performed to return binary code, but silicon photonics chips lack electrical probing functionalities making this method inapplicable
Solution Approach 1:
The patent replaces the electrical probing system with an optical probing system. Instead of using electrical fuses and electrical probes, the invention uses optical gratings, waveguides, and infrared cameras to read identification patterns. The mechanical/electrical interaction is substituted with optical interaction, allowing identification of photonics chips that lack electrical probing functionalities.
Solution Approach 2:
The patent changes the domain of identification from electrical parameters (binary code through electrical fuses) to optical parameters (light scattering patterns through optical gratings). By changing the physical parameter domain from electrical to optical, the system becomes compatible with silicon photonics chips that have optical but not electrical probing capabilities.
2Adaptability or versatility
If optical gratings with damaged regions are used for identification, then chip tracking is enabled without electrical connections, but the method requires infrared light and specialized detection equipment
Solution Approach 1:
The patent introduces optical gratings and waveguides as intermediary structures that encode identification information in visible light scattering patterns. These intermediaries translate the invisible infrared damage patterns into visible optical signals that can be captured by standard cameras, reducing the need for specialized infrared detection equipment.
3Manufacturing precision
If damaged regions are created using external laser, then unique scattering spots are induced for identification, but the manufacturing process requires precise laser control and positioning
Solution Approach 1:
The patent performs preliminary actions by first fabricating the optical gratings and waveguides with high precision using standard photolithography techniques, then subsequently using the laser to create damage patterns. The preliminary structural fabrication establishes the optical pathways, and the laser damage patterns are superimposed afterward, separating the precision structural work from the identification marking work.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables tracking and identification of photonics chips without electrical connections, using infrared light to decode unique patterns for chip identification.
Implementation Method 1
at least one damaged region for inducing scattering spots positioned in a unique pattern on the at least one waveguide structure
Implementation Method 2
using infrared light to decode unique patterns for chip identification
Data Source
Figure 1
Figure 2A~2D
Figure 3~4
AI summary
The present disclosure relates to semiconductor structures and, more particularly, to an identification system, method of manufacture and method of use. The structure includes at least one waveguide structure and at least one damaged region positioned in a unique pattern on the at least one waveguide structure.