Reconfigurable Waveguide Channels for Flexible Chiplet Communication

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Solution Overview

Problem

Heterogeneous chiplet integration in electronic systems faces challenges with high-throughput data exchange, limited communication flexibility, and increased power consumption due to the use of wireline and phased array technologies, which are not suitable for non-adjacent chiplets and require complex transceiver architectures.

Innovation Solution

A reconfigurable coupler-based communication system using waveguides that supports flexible, multidrop, and multimode communication without phased arrays, enabling beamforming and beam-steering capabilities through software-defined channels with reconfigurable coupling coefficients.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If wireline communication over point-to-point wired interconnect is used, then high data throughput is achieved, but communication flexibility is limited and transceiver architecture complexity increases

Engineering Contradiction:

Improvedata throughputVSAvoidtransceiver architecture complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent introduces waveguides as intermediary structures that mediate communication between chiplets. Instead of direct point-to-point wired connections requiring complex transceivers, the waveguide acts as a shared medium that simplifies the transceiver architecture while maintaining high throughput through guided electromagnetic wave propagation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The waveguide structure serves multiple functions simultaneously: it provides guided wave propagation for high throughput, enables flexible communication topologies through software control, and supports multiple chiplets in a shared medium. This universal structure replaces multiple specialized point-to-point interconnects.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Length of stationary object

If phased array transceiver architecture is used for mm-Wave/sub-THz communication, then communication distance and spatial-multiplexing are improved, but power consumption and device complexity increase

Engineering Contradiction:

Improvecommunication distanceVSAvoidpower consumption

Core Design Contradiction:

Length of stationary objectVSUse of energy by moving object

Solution Approach 1:

The patent extracts the beamforming and beam-steering capabilities from the complex phased array transceiver architecture and implements them through software-defined control of the waveguide system. This removes the need for multiple active transceiver elements while maintaining the ability to control signal direction and distance.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical/electrical phased array system with a waveguide-based system controlled by software. Instead of using multiple antenna elements with phase shifters, the invention uses a single or few waveguide connections with programmable routing, substituting complex hardware control with software logic.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If phased array transceiver architecture is used, then beamforming and beam-steering capabilities are achieved, but interference and coupling issues from uncontrolled channel increase

Engineering Contradiction:

Improvebeamforming capabilityVSAvoidinterference and coupling

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the fundamental parameter of channel control from uncontrolled electromagnetic propagation in phased arrays to controlled waveguide propagation. The waveguide parameters (geometry, material, routing) are designed to provide controlled signal paths, eliminating the interference and coupling issues inherent in uncontrolled wireless channels while maintaining beamforming capabilities through software.

Inventive Principle:

Principle #35Parameter changes

4Productivity

If wireline interconnect is used for adjacent chiplets, then high data throughput is achieved, but communication is limited to adjacent chiplets only

Engineering Contradiction:

Improvedata throughputVSAvoidcommunication topology flexibility

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent transitions from one-dimensional adjacent chiplet communication to multi-dimensional communication through the waveguide medium. The waveguide can route signals across the package in multiple directions and dimensions, enabling non-adjacent chiplet communication while maintaining high throughput through the same physical infrastructure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides efficient, flexible, and energy-efficient communication between chiplets, dies, packages, and PCBs, supporting various topologies and reducing power consumption while maintaining high data throughput and minimizing interference.

Implementation Method 1

a waveguide, configured to direct a signal from the first antenna to the second antenna or the third antenna

Methodology Applied

Scientific EffectWaveguide: Waveguide

Implementation Method 2

a directional coupler, configured to direct a greater portion of the signal to the second antenna than to the third antenna

Methodology Applied

Scientific EffectDirectional coupling:

Data Source

PatentUS20250392033A1Reconfigurable channels for multidrop, multimode, and dual polarization communication between any of chiplets, dies, packages, modules, and printed circuit boards

Publication Date: 2025.12.25 INTEL CORP

AI summary

An integrated chiplet system includes a printed circuit board (PCB), including a first antenna; a first chiplet, electrically conductively coupled to a second antenna; a second chiplet, electrically conductively coupled to a third antenna; and a waveguide, configured to direct a signal from the first antenna to the second antenna or the third antenna.