Waveguide Power Combiner With Integrated Cooling Loop
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Solution Overview
Problem
Existing power combiners face issues with insertion loss, back reflection, and limited frequency band capabilities due to their coaxial geometry and reliance on additional components like tuners and filters. Additionally, they struggle with heat dissipation, leading to performance degradation under high peak and average power conditions.
Innovation Solution
The proposed power combiner utilizes waveguide structures to combine electromagnetic radiation inputs without additional system components, minimizing insertion loss and back reflection. It features a central combining conduit with a specific diameter to reduce reflections and a cooling loop integral to the power input structures for efficient heat dissipation. Temperature sensors and a computing device control the cooling loop, ensuring optimal operation based on temperature thresholds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If waveguide structures are used to combine electromagnetic radiation inputs, then insertion loss and back reflection are minimized, but device complexity increases due to the need for precise waveguide geometry and integration
Solution Approach 1:
The patent merges the waveguide structure with the power combiner body into an integrated unit. The waveguide is formed as an integral part of the combiner housing, eliminating the need for separate waveguide components and reducing assembly complexity while maintaining low insertion loss and back reflection performance
Solution Approach 2:
The waveguide structure serves multiple functions: it guides electromagnetic radiation inputs, provides structural support, and integrates with the cooling loop system. This multi-functionality reduces the number of separate components needed while achieving the desired low loss performance
2Temperature
If a cooling loop is integrated into power input structures, then heat dissipation is improved, but manufacturing complexity increases due to integral formation requirements
Solution Approach 1:
The cooling loop is merged with the power input structure into a single integrated component. The loop is formed directly within the power input structure body, eliminating the need for separate cooling components and complex assembly processes while achieving effective heat dissipation
Solution Approach 2:
The manufacturing process utilizes parameter changes in the material during formation to create the cooling loop geometry. By controlling the material properties and forming parameters, the integral cooling loop is created directly during manufacturing without requiring additional machining or assembly steps
3Reliability
If temperature sensors and computing devices are added for cooling control, then operational reliability is improved, but device complexity increases
Solution Approach 1:
Temperature sensors provide feedback on the thermal state of power input structures to the computing device. The computing device uses this feedback to automatically control the cooling loop operation, ensuring reliable thermal management while keeping the control system relatively simple through automated decision-making algorithms
Solution Approach 2:
The cooling control system operates autonomously using temperature sensor data and pre-programmed thresholds. The computing device automatically activates or deactivates the cooling loop based on thermal conditions without requiring manual intervention, improving reliability while minimizing operational complexity
4Adaptability or versatility
If waveguide structures replace coaxial geometry, then frequency band capability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The waveguide structure is merged with the power combiner body, allowing the waveguide geometry to be formed during the primary manufacturing process. This integration reduces the need for separate precision machining operations and enables broader frequency band capability while managing manufacturing precision requirements through unified fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves improved bandwidth and power efficiency, maintaining full power handling while reducing manufacturing costs. The integrated cooling system effectively manages heat, preventing performance degradation under high power conditions. The modular design with solid-state power inputs allows for precise control of electromagnetic radiation parameters.
Implementation Method 1
a cooling loop configured to dissipate heat from at least one of the power input structures to an external environment of the power combiner
Data Source
AI summary
Power combiners and associated computer-implemented methods and computer program products are provided. An example power combiner includes a plurality of power input structures each of which defines a waveguide that receives a respective electromagnetic radiation input from a respective power source and a central combining conduit. The central combining conduit receives the respective electromagnetic radiation inputs communicated via respective power input structures and combines the respective electromagnetic radiation inputs into a combined power signal for output via an output port communicably coupled with the central combining conduit. The power combiner may also include a cooling loop configured to dissipate heat from at least one of the power input structures to an external environment of the power combiner.