Waveguide Coupling Structure for High-Frequency Signal Transmission
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Solution Overview
Problem
Miniaturization of flip-chip coupling parts between electronic components for high-frequency signal transmission leads to increased mounting costs and potential signal transmission losses due to impedance mismatch and reinforcement issues, which can affect the strength and frequency characteristics of the coupling.
Innovation Solution
The implementation of a waveguide structure using coupling parts that electrically and mechanically connect the ground conductors of a printed wiring board and an MMIC chip, allowing signal transmission through mode transduction without direct physical coupling of signal lines, thereby reducing the need for miniaturization and minimizing signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the coupling part between electronic components is miniaturized to shorten signal transmission distance, then signal transmission loss is reduced, but mounting cost increases and coupling strength becomes insufficient
Solution Approach 1:
The patent introduces a waveguide structure as an intermediary component between the printed wiring board and MMIC chip. This waveguide serves as a mediator that enables signal transmission without requiring direct miniaturized coupling, thus avoiding the increased mounting costs associated with precision miniaturized bump coupling while still achieving low signal loss through controlled electromagnetic field transmission.
Solution Approach 2:
The patent replaces the mechanical direct-contact coupling system with an electromagnetic field-based waveguide transmission system. Instead of relying on physical miniaturized bumps for signal transmission, the invention uses electromagnetic waves guided through a structured pathway, substituting mechanical precision requirements with electromagnetic field control.
2Loss of energy
If the coupling part is miniaturized to shorten signal transmission distance, then signal transmission loss is reduced, but the strength of the coupling part becomes insufficient
Solution Approach 1:
The patent merges multiple functions into the waveguide structure: it provides mechanical support, establishes electrical grounding, guides electromagnetic signals, and provides structural reinforcement. This consolidation allows the coupling system to achieve both low signal loss and high mechanical strength simultaneously, as the waveguide structure inherently provides both electromagnetic guidance and mechanical robustness.
3Loss of energy
If the coupling part is miniaturized to shorten signal transmission distance, then signal transmission loss is reduced, but frequency characteristics deteriorate due to impedance mismatch
Solution Approach 1:
The patent carefully controls key parameters of the waveguide structure including its dimensions, positioning, and grounding configuration to optimize impedance matching across the operating frequency range. By adjusting parameters such as the waveguide width, height, and distance from signal lines, the invention achieves both low signal loss and stable frequency characteristics without the impedance mismatch problems that plague miniaturized direct coupling.
4Ease of operation
If direct physical coupling of signal lines is used, then signal transmission is achieved, but parasitic capacitance effects increase causing signal loss
Solution Approach 1:
The patent extracts the signal transmission function from direct physical contact between signal lines and separates it into distinct components: the signal lines remain on their respective substrates while the waveguide provides a separate electromagnetic transmission pathway. This extraction eliminates the parasitic capacitance that would exist at direct coupling points, as the signal transmission occurs through controlled electromagnetic fields rather than direct conductor contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables low-loss signal transmission between separate signal lines while avoiding the costs and performance issues associated with miniaturization, maintaining signal integrity and reducing parasitic capacitance effects.
Implementation Method 1
a waveguide including the first ground conductor surface, the second ground conductor surface, and a pair of first ground conductor walls that are opposed to each other and are placed between the first ground conductor surface and the second ground conductor surface; a first transducing part that transduces a signal between the first signal line and the waveguide; and a second transducing part that transduces a signal between the second signal line and the waveguide
Data Source
AI summary
An electronic device includes a first electronic component including a first signal line and a first ground conductor surface, a second electronic component that is placed above the first electronic component and includes a second signal line and a second ground conductor surface opposed to the first ground conductor surface, a waveguide including the first ground conductor surface, the second ground conductor surface, and a pair of first ground conductor walls that are opposed to each other and are placed between the first ground conductor surface and the second ground conductor surface, a first transducing part that transduces a signal between the first signal line and the waveguide, and a second transducing part that transduces a signal between the second signal line and the waveguide.