Waveguide Gap Control via Sacrificial Layer
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Solution Overview
Problem
Existing waveguide manufacturing methods lack sensitivity and control over external influences, affecting the propagation of electromagnetic waves, and struggle with accurate control of waveguide properties, leading to variations in manufacturing yield.
Innovation Solution
A method involving a first and second waveguide part configured to jointly guide electromagnetic waves, with a gap between them that can be adjusted by changing the substance, electromagnetic properties, or size, allowing for high sensitivity and controlled propagation properties, while ensuring accurate design and minimal variation across wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a waveguide is designed to be highly sensitive to external influences, then sensing capability is improved, but manufacturing precision control becomes more difficult
Solution Approach 1:
The waveguide is divided into first and second waveguide parts separated by a gap, allowing independent control of each part's properties while maintaining overall sensitivity. This segmentation enables precise control of the gap dimensions and material composition to achieve desired sensing characteristics.
Solution Approach 2:
The invention changes physical parameters of the waveguide by adjusting gap size, gap material composition, and electromagnetic properties of the gap region. These parameter changes enable high sensitivity to external influences while maintaining manufacturability through standard fabrication processes.
2Measurement precision
If the gap between waveguide parts is made smaller to increase sensitivity, then sensing capability is improved, but manufacturing complexity increases
Solution Approach 1:
A sacrificial layer is introduced as an intermediary material during manufacturing to define the gap between waveguide parts. This sacrificial layer is subsequently removed to create the final gap, simplifying the manufacturing process while enabling precise control of small gap dimensions.
Solution Approach 2:
The gap structure is preliminarily formed using a sacrificial layer before final waveguide parts are assembled. This preliminary action allows precise gap definition to be achieved through standard deposition and etching processes rather than requiring complex direct fabrication.
3Reliability
If waveguide properties are optimized for specific applications, then performance is improved, but manufacturing yield decreases due to stricter tolerances
Solution Approach 1:
The invention provides flexibility in parameter selection including gap size, gap material composition, and waveguide part dimensions. These parameter changes allow optimization for specific applications while maintaining compatibility with standard manufacturing tolerances, thereby preserving manufacturing yield.
Solution Approach 2:
Different regions of the waveguide can have different properties - the gap region can be optimized for sensing while waveguide parts maintain standard dimensions. This local quality approach allows performance optimization without requiring entire structures to meet stringent tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a highly sensitive waveguide that can accurately detect and control external influences, providing a high manufacturing yield with improved sensitivity and precision in waveguide properties, enabling effective sensing and actuation applications.
Implementation Method 1
an electro-magnetic field intensity of a waveguide mode being high at a position of the gap
Implementation Method 2
an electro-magnetic field intensity of a waveguide mode being high at a position of the gap
Data Source
Figure 1~2
Figure 3~4
Figure 5a~5f
AI summary
A method for manufacturing of a waveguide (100) for guiding an electro-magnetic wave comprising: forming a first waveguide layer (502), a sacrificial layer (504) and a protection layer (506) on a first wafer (500), patterning to define a pattern of a first waveguide part (102) and a supporting structure (112) in the first waveguide layer (502); exposing the sacrificial layer (504) on the first waveguide part (102) while the protection layer (506) still covers the sacrificial layer (504) on the supporting structure (112); removing the sacrificial layer (504) on the first waveguide part (102); removing the protection layer (506); bonding a second wafer (510) to the sacrificial layer (504) of the first wafer (500) such that a second waveguide part (104) is supported by the supporting structure (112) and a gap (106) corresponding to the thickness of the sacrificial layer (504) is formed between the first and second waveguide parts.