Semiconductor Optical Waveguide Heat Dissipation Design
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Solution Overview
Problem
Silicon photonic devices face challenges in thermal conduction control and heat dissipation efficiency during optical modulation, leading to thermal interference and increased device area due to the need for increased distance between modulators.
Innovation Solution
A semiconductor device design featuring an optical waveguide with a heat conducting portion adjacent to the heater, penetrating the interlayer insulating films, and a heat radiation plate to enhance heat dissipation and prevent thermal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the distance between modulators is increased to prevent thermal interference, then thermal interference is reduced, but the device area increases
Solution Approach 1:
The patent introduces a heat conducting portion as an intermediary thermal management structure between the heater and the optical waveguide. This mediator efficiently conducts heat away from the waveguide region, preventing thermal interference between adjacent modulators while allowing them to be placed closer together, thus reducing device area
Solution Approach 2:
The heat conducting portion extends vertically through the interlayer insulating films, utilizing the vertical dimension for heat dissipation. This three-dimensional thermal management approach allows heat to be conducted away in the vertical direction, enabling closer horizontal spacing of modulators without thermal interference
2Power
If intense heat is supplied to the optical waveguide for modulation, then modulation performance is improved, but heat resistance requirements increase
Solution Approach 1:
The heat conducting portion acts as a thermal intermediary that rapidly conducts intense heat away from the optical waveguide during modulation. This mediator structure enables high-power modulation while protecting the waveguide from excessive temperature rise, maintaining reliability
Solution Approach 2:
The patent extracts heat from the optical waveguide region by providing a dedicated heat conducting portion that rapidly conducts thermal energy away from the waveguide. This extraction mechanism allows intense heating for modulation while preventing heat accumulation that would compromise heat resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves thermal response rate, reduces device area, and enhances heat dissipation efficiency, preventing unintentional modulation and thermal interference, while maintaining high heat resistance and reliability.
Implementation Method 1
a heat conducting portion adjacent to the optical waveguide and the heater via the interlayer insulating film and penetrating the interlayer insulating film
Implementation Method 2
a method of making using a thermo-optical effect based on dependence of the refractive index on a temperature
Data Source
AI summary
In an optical waveguide supplied with electricity by using a heater, miniaturization of the device is achieved by enhancing heat dissipation efficiency and heat resistance. In a modulator including an optical waveguide formed on an insulating film, a first interlayer insulating film that covers the optical waveguide, a heater formed on the first interlayer insulating film, and a second interlayer insulating film that covers the heater, a heat conducting portion adjacent to the optical waveguide and the heater and penetrating the first and second interlayer insulating films is formed.