Topside Waveguide Heat Sink for IC Package Thermal Management
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Solution Overview
Problem
The integration of waveguide antennas on top of integrated circuit packages for millimeter-wave devices interferes with efficient heat removal from the IC device die, as there is no room for a heat sink without interfering with the antennas, which can lead to operational limitations and potential damage.
Innovation Solution
A mechanism is implemented where a waveguide is thermally coupled to the IC device die and extends to a heat sink mounted adjacent to the package on the PCB, using thermal interface material for enhanced heat transfer while maintaining RF performance by positioning the heat sink structures on the side of the waveguide, avoiding interference with the antennas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If waveguide antennas are integrated on top of integrated circuit packages, then the footprint of the package and waveguide assembly on the PCB is reduced, but heat removal from the integrated circuit die is prevented
Solution Approach 1:
The patent positions the heat sink on the side surface of the waveguide structure rather than on the top surface, utilizing the vertical/d lateral dimension to resolve the conflict between antenna placement and heat dissipation. This dimensional repositioning allows both functions to coexist without interference.
Solution Approach 2:
The waveguide structure is segmented into distinct functional regions: the top surface houses the antenna feeds and radiating elements, while the side surface accommodates the heat sink. This segmentation allows independent optimization of RF performance and thermal management.
2Temperature
If heat sink is placed on top of integrated circuit package, then heat removal is improved, but it interferes with antenna structures
Solution Approach 1:
The heat sink is relocated from the top surface (2D plane) to the side surface of the waveguide structure, utilizing a different spatial dimension. This eliminates interference with the antenna structures while maintaining effective thermal coupling to the integrated circuit die.
Solution Approach 2:
Different surfaces of the waveguide structure are assigned different functional properties: the top surface is optimized for RF radiation with smooth conductive surfaces, while the side surface is optimized for heat dissipation with the heat sink attachment. This local differentiation resolves the functional conflict.
3Loss of energy
If antenna feeds are moved closer to circuitry by incorporating them on the periphery of the integrated circuit package, then power loss due to transmission lines is reduced, but heat removal pathways are blocked
Solution Approach 1:
The solution utilizes the side surface dimension of the waveguide structure to accommodate heat sinks, allowing peripheral antenna feed placement for reduced transmission loss while maintaining thermal pathways through the waveguide body to the side-mounted heat sinks.
Solution Approach 2:
The waveguide structure serves multiple functions simultaneously: it acts as the transmission medium for RF signals from the peripheral antenna feeds, provides structural support, and serves as a thermal conduction path to the side-mounted heat sinks. This multi-functionality resolves the apparent conflict between signal integrity and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively dissipates heat from the IC device die, reducing heat by 25-50% and maintaining good RF performance by allowing heat transfer without interfering with the antenna structures, thus preventing potential damage and improving operational parameters.
Implementation Method 1
a waveguide mounted on the topside surface of the semiconductor device package and thermally coupled to the semiconductor device die... The waveguide transports the heat to a heat sink
Implementation Method 2
using thermal interface material for enhanced heat transfer
Implementation Method 3
a heat sink coupled to the waveguide... effectively dissipates heat from the IC device die
Implementation Method 4
a heat sink coupled to the waveguide... dissipates heat
Data Source
AI summary
A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. The waveguide is mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency performance of the waveguide.