Bottom-side Heatsinking Waveguide for IC Packages
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Solution Overview
Problem
The integration of waveguide antennas on top of integrated circuit packages for mmWave devices poses a challenge in thermal management, as there is no room for a heat sink without interfering with the antennas, which can lead to heat-related damage and limited operational parameters.
Innovation Solution
A heat sink is thermally coupled to a waveguide mounted on the top surface of the integrated circuit package, with the waveguide transporting heat to a heat sink located adjacent to the package on the printed circuit board, allowing for effective thermal dissipation while maintaining RF performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is integrated into the integrated circuit package, then heat dissipation is improved, but it interferes with the waveguide antennas and degrades RF performance
Solution Approach 1:
The patent divides the thermal management function into two separate locations: a first heat sink integrated into the package substrate and a second heat sink mounted on the circuit board. This segmentation allows the RF waveguide antennas to be positioned on the package top surface without interference from heat sink structures, thereby maintaining RF performance while achieving effective heat dissipation through multiple pathways.
2Loss of energy
If waveguide antennas are placed close to the integrated circuit die, then signal transmission efficiency is improved, but heat generated from the die can damage the integrated circuit
Solution Approach 1:
The patent introduces the package substrate as an intermediary thermal management layer between the integrated circuit die and the external environment. The substrate integrates a first heat sink that provides immediate thermal relief to the die, while the close positioning of waveguide antennas to the die is maintained for signal efficiency. This intermediary structure enables simultaneous achievement of low power loss and heat damage prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation from the integrated circuit die, reducing heat by 25-50% and preventing damage, while maintaining good RF performance by separating the heat dissipation region from the antenna structures, allowing for improved operational parameters.
Implementation Method 1
The waveguide is thermally coupled to the integrated circuit die and transports the heat to a heat sink
Implementation Method 2
a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board
Implementation Method 3
a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board
Data Source
AI summary
A mechanism is provided to remove heat from an integrated circuit (IC) device die by directing heat through a waveguide to a heat sink. Embodiments provide the waveguide mounted on top of a package containing the IC device die. The waveguide is thermally coupled to the IC device die. The waveguide transports the heat to a heat sink coupled to the waveguide and located adjacent to the package on top of a printed circuit board on which the package is mounted. Embodiments provide both thermal dissipation of the generated heat while at the same time maintaining good radio frequency (RF) performance of the waveguide.