Waveguide ID Patterning for Tracking Diced Silicon Photonics Chips
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Solution Overview
Problem
Silicon photonics chips without electrical probing functionalities cannot be identified after being diced from the wafer, as there are no existing tracking methods for these chips.
Innovation Solution
A photonics structure with damaged regions in unique patterns on waveguide structures, which are invisible in optical light but visible in infrared, is used to encode identification information. These damaged regions are created using an external laser and can be read by an infrared camera to decode the chip's identity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If damaged regions are created in waveguide structures for identification, then unique pattern identification is achieved, but the damaged regions are invisible in optical light and require infrared detection
Solution Approach 1:
The patent transitions from visible optical light to infrared wavelength for detection. The damaged regions in the waveguide structure do not scatter or absorb visible light significantly, making them invisible in optical light. However, they interact strongly with infrared light, allowing detection in this different wavelength dimension. This dimensional change in the electromagnetic spectrum enables the identification system to work.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the identification of photonics chips without electrical probing capabilities, enabling tracking of bare dies after dicing and providing a unique identification system for silicon photonics chips.
Implementation Method 1
making the regions visible only in infrared light, allowing for identification through an infrared camera
Data Source
AI summary
The present disclosure relates to semiconductor structures and, more particularly, to an identification system, method of manufacture and method of use. The structure includes at least one waveguide structure and at least one damaged region positioned in a unique pattern on the at least one waveguide structure.