Waveguide Launch Using Conductive Polymer Interconnection

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Solution Overview

Problem

Existing waveguide launches are complex and expensive to manufacture due to their multilayer structures, making them costly and fragile.

Innovation Solution

A waveguide launch design comprising two substrates with an interconnection waveguide defined by an electrically conductive polymer, allowing for simpler manufacturing and assembly by connecting two separate parts with a polymer interconnection waveguide, which is flexible and less prone to fragility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional multilayer waveguide structures are used, then waveguide functionality is achieved, but manufacturing complexity and cost increase significantly

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidmultilayer structure complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The waveguide structure is divided into separate substrates (first substrate with internal waveguide, second substrate with backshort) connected by an interconnection waveguide. This segmentation allows each substrate to be manufactured independently using standard PCB techniques, avoiding the need for complex multilayer waveguide fabrication while maintaining functional integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The interconnection waveguide uses an electrically conductive polymer material instead of traditional rigid conductive materials. This parameter change in material properties enables flexible routing and simplifies assembly while maintaining electrical conductivity for microwave signal transmission.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If traditional rigid waveguide structures are used, then structural strength is maintained, but fragility increases and flexibility decreases

Engineering Contradiction:
ImprovedurabilityVSAvoidflexibility
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The interconnection waveguide is constructed using an electrically conductive polymer that provides flexibility while maintaining structural integrity. This flexible construction allows the waveguide to accommodate mechanical stress and movement without breaking, improving reliability while enabling easier installation and adaptation to different configurations.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design simplifies the manufacturing process, reduces costs, and results in a more flexible and durable waveguide launch capable of handling microwave and mm wave signals effectively.

Implementation Method 1

an interconnection waveguide extending between the first and third electrically conductive layers, a first end of the interconnection waveguide extending at least partly around the first mouth of the internal waveguide and a second end of the interconnection waveguide extending at least partly around the recess mouth, the wall defining the interconnection waveguide being an electrically conductive polymer

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Implementation Method 2

first and second electrically conductive layers on the first and second faces respectively each being in electrical contact with the internal waveguide side wall

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10290915B2Waveguide launch comprising a first substrate having an internal waveguide coupled by a deformable waveguide to a second substrate having a backshort therein
Publication Date: 2019.05.14 FILTRONIC BROADBAND LTD
  • US10290915B2 patent drawing
  • US10290915B2 patent drawing
  • US10290915B2 patent drawing

AI summary

A waveguide launch includes afirst substrate having a first electrically insulating layer having first and second faces,an internal waveguide extending through the first electrically insulating layer,the internal waveguide being defined by an electrically conductive internal waveguide side wall, and,first and second electrically conductive layers in electrical contact with the internal waveguide side wall, andan electrically conductive probe launch. The waveguide launch also includes;a second substrate having a second electrically insulating layer having third and fourth faces,a backshort recess arranged within the second electrically insulating layer,a third electrically conductive layer on the third face, and,an interconnection waveguide extending between the first and third faces.