Waveguide Launcher Package With Air Cavity for Low Insertion Loss
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Solution Overview
Problem
Conventional semiconductor manufacturing processes struggle to create precise circuit waveguide interfaces for high-frequency applications, such as millimeter wave systems, leading to increased cost and complexity.
Innovation Solution
A method for fabricating circuit waveguide interfaces during wafer-scale die packaging using a high-k glass or ceramic carrier with an air cavity structure and conductive via/ring structures to reduce insertion loss and relax alignment tolerance requirements, integrating a differential pair to waveguide launcher in package (LIP) structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor manufacturing processes are used to create waveguide interfaces, then manufacturing simplicity is maintained, but manufacturing precision is insufficient for high-frequency applications
Solution Approach 1:
The waveguide interface structure is segmented into distinct functional regions: a waveguide region with air cavity for high-frequency signal transmission, a die region for mounting the integrated circuit die, and a transition region with radiating elements. This segmentation allows each region to be optimized independently using appropriate manufacturing techniques, achieving high precision where needed while maintaining overall manufacturing simplicity.
Solution Approach 2:
A glass or ceramic carrier substrate serves as an intermediary between the conventional semiconductor manufacturing process and the high-precision waveguide interface requirements. The carrier substrate provides a stable platform that can be processed with conventional techniques, while the waveguide region formed on it achieves the necessary precision for millimeter-wave applications through its specialized structure including air cavities and conductive patterns.
2Loss of energy
If precise waveguide interfaces are manufactured to reduce insertion loss, then signal quality is improved, but device complexity increases
Solution Approach 1:
The waveguide interface employs local quality by creating an air cavity specifically in the waveguide region where low dielectric constant is needed for minimal signal loss, while the die region and other areas maintain their conventional structures. This localized optimization reduces insertion loss for high-frequency signals without unnecessarily complicating the entire device structure.
Solution Approach 2:
The waveguide interface structure combines multiple materials with different properties: air (for low dielectric constant in the cavity), glass or ceramic (for the carrier substrate providing mechanical support and electrical properties), and conductive materials (for the radiating elements and ground planes). This composite approach enables the structure to simultaneously achieve low insertion loss and manageable complexity by assigning specific functions to each material.
3Reliability
If conventional packaging processes are used, then manufacturing cost is controlled, but high-frequency communication capability cannot be achieved
Solution Approach 1:
The invention merges the waveguide interface fabrication with the conventional die packaging process by forming the waveguide region, air cavity, and radiating elements on the glass or ceramic carrier substrate before die attachment. This integration allows high-frequency communication capability to be achieved without requiring separate, complex post-packaging modifications, thereby controlling manufacturing cost and complexity while ensuring reliability.
Solution Approach 2:
The waveguide interface structures including the air cavity and conductive radiating elements are formed in advance on the carrier substrate before the integrated circuit die is mounted and before final packaging. This preliminary action ensures that the high-frequency transmission path is established and optimized before any subsequent packaging steps, guaranteeing the required communication capability while streamlining the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of high-performance circuit waveguide interfaces with reduced insertion loss and lower cost and complexity, facilitating high-frequency communication in semiconductor devices.
Implementation Method 1
a high-k dielectric carrier substrate... a glass layer surrounding a ceramic layer... the ceramic layer having a dielectric constant k of at least approximately k=5.8
Implementation Method 2
an air cavity structure... positioned in the waveguide region... to reduce insertion loss
Implementation Method 3
conductive via/ring structures... a first array of conductors... a second array of conductors... to reduce insertion loss
Data Source
AI summary
A wafer-scale die packaging device is fabricated by providing a high-k glass carrier substrate having a ceramic region which includes a defined waveguide area and extends to a defined die attach area, and then forming, on a first glass carrier substrate surface, a differential waveguide launcher having a pair of signal lines connected to a radiating element that is positioned adjacent to an air cavity and surrounded by a patterned array of conductors disposed over the ceramic region in a waveguide conductor ring. After attaching a die to the glass carrier substrate to make electrical connection to the differential waveguide launcher, a molding compound is formed to cover the die, differential waveguide launcher, and air cavity, and an array of conductors is formed in the molding compound to define a first waveguide interface perimeter surrounding a first waveguide interface interior.