Integrated Waveguide Launcher Package for Low-Loss mm-Wave PCB Coupling
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Solution Overview
Problem
Integrated circuit packages with mm-wave transceivers face signal loss due to lossy mm-wave substrates and air gaps caused by ball grid arrays, leading to reduced signal-to-noise ratio and performance.
Innovation Solution
The use of an integrated waveguide launcher connected to a semiconductor die and a land grid array on the package bottom surface, eliminating air gaps and enabling a low-cost, high-performance mm-wave transition compatible with standard package technologies and any PCB material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ball grid array with solder balls is used to mount the package, then the package can be connected to the PCB, but air gaps are created that cause discontinuities in the surface current of the waveguide, leading to signal mismatch and higher signal loss
Solution Approach 1:
The patent removes the ball grid array mounting structure that creates air gaps and discontinuities. Instead, it extracts only the essential function of electrical connection while eliminating the harmful air gap interface, achieving direct waveguide-to-PCB coupling without the intermediate solder ball structure.
Solution Approach 2:
The patent merges the waveguide launcher structure directly with the PCB mounting surface, eliminating the separation created by ball grid arrays. The waveguide launcher is integrated such that its output directly interfaces with the PCB waveguide or antenna, creating a continuous electromagnetic path without air gaps.
2Ease of operation
If long feed lines are used to route mm-wave paths on the PCB, then the signal can reach the antenna, but the losses increase by around 4 dB per channel, reducing the signal-to-noise ratio
Solution Approach 1:
The patent transitions the signal path from a planar microstrip route on the PCB surface to a three-dimensional waveguide structure. The waveguide launcher provides direct vertical or angled coupling from the package to the PCB, eliminating the need for long lateral feed lines and reducing the electromagnetic path length.
3Loss of energy
If waveguide transitions are integrated on the PCB to reduce losses, then the loss is reduced to roughly 2 dB per channel, but the use of mm-wave substrates remains expensive
Solution Approach 1:
The patent segments the waveguide structure into two parts: an integrated waveguide launcher within the package that operates at mm-wave frequencies, and a standard PCB waveguide or antenna that can be implemented on conventional substrates. This segmentation allows the expensive mm-wave integration to be confined to the smallest necessary area while using cost-effective materials for the remaining structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces signal loss by eliminating discontinuities in waveguides, improving signal isolation, and allowing for direct soldering to PCBs, thus enhancing the performance and cost-effectiveness of mm-wave transitions.
Implementation Method 1
an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals; and a land grid array provided on a bottom surface of the package, the land grid array comprising: a plurality of package terminals, each package terminal configured to be soldered to a connection; and an opening, wherein the opening is aligned with the integrated waveguide launcher
Data Source
AI summary
An integrated circuit package comprising an encapsulant, a semiconductor die in the encapsulant the semiconductor die comprising a plurality of die terminals, an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals and a land grid array provided on a bottom surface of the package. The land grid array comprises a plurality of package terminals, each package terminal configured to be soldered to a printed circuit board, and an opening, wherein the opening is aligned with the integrated waveguide launcher.