Waveguide Lens Mold Design Without Adhesive Lamination
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Solution Overview
Problem
Augmented Reality (AR) lenses are thick due to the use of adhesive for lamination between functional layers and the process is complicated.
Innovation Solution
A mold system comprising multiple slots for accommodating and molding optical waveguide assemblies and lenses without adhesives, allowing for integral molding of lenses with the waveguide assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If adhesive lamination process is used to laminate functional materials, then the AR lenses can be assembled with various functions, but the AR lenses become thick and the process becomes complicated
Solution Approach 1:
The patent merges multiple functional layers (waveguide layer, lens layer, display layer) into a single integrated waveguide lens structure. The mold directly forms the lens on the waveguide substrate, eliminating separate lamination steps and adhesive layers, thereby reducing thickness while maintaining functional versatility.
Solution Approach 2:
The patent extracts and eliminates the adhesive layer from the traditional lamination process. By using direct molding, the adhesive layer is removed entirely, reducing the overall thickness of the AR lens while maintaining the functional integration of various layers.
2Adaptability or versatility
If adhesive lamination process is used to laminate functional materials, then the AR lenses can be assembled with various functions, but the preparation process becomes complicated
Solution Approach 1:
The patent combines multiple preparation steps (lamination, alignment, curing) into a single molding operation. The mold simultaneously forms the lens and integrates it with the waveguide layer, simplifying the preparation process while maintaining functional versatility.
Solution Approach 2:
The patent segments the preparation process into two main stages: (1) forming the waveguide layer with functional materials in the mold, and (2) directly molding the lens on the waveguide layer. This segmentation eliminates intermediate lamination steps, reducing process complexity.
3Reliability
If adhesive layer is used to attach optical waveguide assembly and lens, then the components can be assembled, but the thickness of the waveguide lens increases
Solution Approach 1:
The patent extracts and removes the adhesive layer from the assembly process. The lens is directly molded onto the waveguide assembly, eliminating the need for adhesive while maintaining reliable component attachment through direct integration.
Solution Approach 2:
The patent replaces the mechanical adhesive bonding system with a direct molding integration system. The lens and waveguide assembly are formed as a single integrated structure, eliminating the adhesive layer and reducing thickness while maintaining assembly reliability.
Data Source
AI summary
The present application provides a mold for making a waveguide lens and a waveguide lens, relating to the technical field of electronic products. The mold for making a waveguide lens comprises: a first mold comprising a first slot defined on one side, the first slot being configured to accommodate an optical waveguide assembly with optical assist function; a second mold configured for molding with the first mold, the second mold comprising a second slot defined on a side of the second mold facing the first mold, wherein the second mold is close to a first surface of the optical waveguide assembly, and the second slot is configured for molding a first lens on the first surface. The present application can reduce the thickness of the waveguide lens while reducing the process of preparing the waveguide lens.