Waveguide Light Coupling via Embedded Chip Package
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Solution Overview
Problem
Device manufacturers face challenges in producing microchip packages with low manufacturing costs while maintaining high quality and reliability, particularly due to the complexity and precision required in light coupling techniques using gratings or micro-lenses, which often necessitate tight process control and active alignment.
Innovation Solution
A chip package design that incorporates a waveguide layer with a light coupling mechanism, where a light source is directly coupled into waveguides with accurate z-directional control without the need for costly or tedious alignment systems, by placing the chip package portion within the waveguide layer during its soft or partially cured state, and securing it using a curing process, thereby reducing complexity and space occupied.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional light coupling techniques using gratings or micro-lenses are employed, then light coupling precision is improved, but device complexity and manufacturing cost increase due to tight process control and active alignment requirements
Solution Approach 1:
The patent extracts and removes the complex alignment system and active alignment mechanisms from the device. By using a waveguide structure with integrated light coupling, the patent eliminates the need for separate gratings, micro-lenses, and active alignment systems, thereby reducing device complexity while maintaining light coupling precision through the waveguide's inherent optical confinement and propagation properties
Solution Approach 2:
The waveguide structure serves as an intermediary element that directly couples light from the light source without requiring complex alignment systems. The waveguide acts as a mediator that guides and confines light through its structural design, replacing the need for active alignment mechanisms and complex optical components
2Manufacturing precision
If traditional light coupling techniques are used, then light coupling precision is improved, but manufacturing cost increases due to costly alignment systems
Solution Approach 1:
The patent removes costly active alignment systems and complex optical components from the manufacturing process. The waveguide structure enables direct light coupling through its inherent optical properties, eliminating the need for expensive alignment equipment and reducing manufacturing costs while maintaining precision
Solution Approach 2:
The patent employs a simpler, more cost-effective waveguide structure that replaces expensive alignment systems. The waveguide's integrated design allows for easier and cheaper manufacturing without requiring costly active alignment mechanisms or complex optical components
3Manufacturing precision
If light source is positioned above the waveguide structure, then light coupling is achieved, but the space occupied by the chip package increases
Solution Approach 1:
The patent merges the light source positioning with the waveguide structure by placing the light source within or directly coupled to the waveguide layer. This integration eliminates the need for separate positioning above the waveguide, thereby reducing the overall space occupied by the chip package while maintaining effective light coupling
Solution Approach 2:
The patent transitions from positioning the light source vertically above the waveguide to integrating it within the waveguide layer plane. This dimensional change from vertical positioning to in-plane integration reduces the z-direction height and overall package volume while achieving effective light coupling through the waveguide's optical confinement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances reliability, reduces production time, minimizes errors, and achieves a compact chip package size by eliminating the need for precise alignment systems and reducing the overall thickness of the package.
Implementation Method 1
Waveguides are used to control a propagation of light from one element to another
Implementation Method 2
placing the chip package portion within the waveguide layer during its soft or partially cured state, and securing it using a curing process
Data Source
AI summary
An approach is provided for forming a light coupling in a waveguide layer. The approach involves forming a waveguide layer overlaying an upper surface of a substrate. The approach also involves placing a chip package portion within the waveguide layer in a selected position. The approach further involves forming a molding compound layer overlaying the waveguide layer and the chip package portion. The approach additionally involves curing the molding compound layer to form a cured package. The approach also involves releasing the cured package from the substrate and inverting the cured package. The approach further involves forming a ridge waveguide structure in the waveguide layer by removing a portion of the lower surface of the cured package.