Integrated Rectangular Waveguide Microcircuit for Low-Loss THz Signals

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Solution Overview

Problem

Existing microcircuits face high transmission losses due to radiation and substrate interactions at very high frequencies, and hollow metal waveguides increase circuit size and manufacturing complexity.

Innovation Solution

A microcircuit incorporating a waveguide with a rectangular cross-section is constructed in the junction zone between two chips, laterally delimited by electrical connecting elements such as micropillars or vias, allowing for low-loss signal transmission at frequencies up to 2 THz without increasing overall size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If coplanar waveguide or microstrip lines are used for signal transmission, then the circuit structure is simple and compact, but transmission losses are high due to radiation and substrate interactions

Engineering Contradiction:
Improvewaveguide structureVSAvoidtransmission loss
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The patent transitions from planar coplanar waveguide structures to a three-dimensional rectangular waveguide configuration. The waveguide is formed by four conductive walls enclosing a propagation region, creating a volumetric structure that guides electromagnetic waves in a confined space. This dimensional change eliminates radiation losses inherent in planar structures and reduces substrate interaction losses by containing the electromagnetic field within the waveguide boundaries.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of energy

If hollow metal waveguide is used to reduce transmission losses, then propagation losses are reduced to about 1 dB, but the overall size of the microcircuit increases and manufacturing becomes more complex

Engineering Contradiction:
Improvepropagation lossVSAvoidmanufacturing complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The waveguide is segmented into multiple conductive walls (four separate walls forming the rectangular cross-section) that enclose the propagation region. This segmentation allows each wall to be independently formed and positioned, facilitating manufacturing through standard semiconductor fabrication processes such as depositing conductive layers on separate substrates that are then bonded together. The segmented structure also enables modular assembly and integration with other microcircuit components.

Inventive Principle:
Principle #1Segmentation

3Loss of energy

If hollow metal waveguide with rectangular cross-section is used, then transmission losses are reduced, but the waveguide occupies more space and increases circuit footprint

Engineering Contradiction:
Improvetransmission lossVSAvoidcircuit footprint
Core Design Contradiction:
Loss of energyVSArea of stationary object

Solution Approach 1:

The waveguide walls are formed as thin conductive films or shells deposited on the inner surfaces of the waveguide structure. These thin conductive layers provide the necessary electromagnetic shielding and waveguiding functionality while occupying minimal space. The thin-film construction allows the waveguide to achieve low transmission losses without significantly increasing the overall footprint of the microcircuit.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides low-overall size and low-loss signal transmission suitable for future 6G communication applications, with reduced propagation losses and simplified manufacturing.

Implementation Method 1

a waveguide with a rectangular cross-section... configured to guide an electromagnetic wave with a frequency greater than or equal to 100 GHz

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Data Source

PatentUS12424722B2Integrated waveguide microcircuit
Publication Date: 2025.09.23 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
  • US12424722B2 patent drawing
  • US12424722B2 patent drawing
  • US12424722B2 patent drawing

AI summary

A microcircuit integrating a waveguide with a rectangular cross-section, the microcircuit including a first chip and a second chip assembled on each other, the waveguide being located in a junction zone between chips and extending in parallel to the chips, the waveguide including a first conductive plate located on the side of the first chip and parallel to the first chip, and a second conductive plate, located on the side of the second chip and parallel to the second chip, the waveguide being laterally delimited on one and the other side of the waveguide by one or more electrical connecting elements electrically connecting the first chip to the second chip.